KW

Kwong Hon Wong

IBM: 69 patents #1,072 of 70,183Top 2%
Infineon Technologies Ag: 7 patents #1,452 of 7,486Top 20%
NS Novellus Systems: 2 patents #345 of 780Top 45%
PL Pismo Labs Technology Limited: 1 patents #42 of 57Top 75%
📍 Croton-on-Hudson, NY: #5 of 168 inventorsTop 3%
🗺 New York: #1,072 of 115,490 inventorsTop 1%
Overall (All Time): #29,528 of 4,157,543Top 1%
70
Patents All Time

Issued Patents All Time

Showing 1–25 of 70 patents

Patent #TitleCo-InventorsDate
D730331 Pole mount for communication device Chin Wai Yeung 2015-05-26
8481415 Self-aligned contact combined with a replacement metal gate/high-K gate dielectric Jun Yuan, Dechao Guo, Yanfeng Wang, Gan Wang 2013-07-09
8304912 Structure and method for MOSFET gate electrode landing pad Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Carl Radens, Chih-Chao Yang 2012-11-06
7906428 Modified via bottom structure for reliability enhancement Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Conal E. Murray, Carl Radens +1 more 2011-03-15
7804136 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2010-09-28
7683418 High-temperature stable gate structure with metallic electrode Dae-Gyu Park, Oleg Gluschenkov, Michael A. Gribelyuk 2010-03-23
7657995 Method of fabricating a microelectromechanical system (MEMS) switch Louis C. Hsu, Timothy J. Dalton, Lawrence A. Clevenger, Carl Radens, Chih-Chao Yang 2010-02-09
7528065 Structure and method for MOSFET gate electrode landing pad Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Carl Radens, Chih-Chao Yang 2009-05-05
7521345 High-temperature stable gate structure with metallic electrode Dae-Gyu Park, Oleg Gluschenkov, Michael A. Gribelyuk 2009-04-21
7491660 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2009-02-17
7488677 Interconnect structures with encasing cap and methods of making thereof Louis C. Hsu, Timothy J. Dalton, Carol Radens, Chih-Chao Yang, Lawrence A. Clevenger +1 more 2009-02-10
7462527 Method of forming nitride films with high compressive stress for improved PFET device performance Richard A. Conti, Ronald P. Bourque, Nancy R. Klymko, Anita Madan, Michael C. Smits +2 more 2008-12-09
7348870 Structure and method of fabricating a hinge type MEMS switch Louis C. Hsu, Timothy J. Dalton, Lawrence A. Clevenger, Carl Radens, Chih-Chao Yang 2008-03-25
7282802 Modified via bottom structure for reliability enhancement Lawrence A. Clevenger, Timothy J. Dalton, Louis C. Hsu, Conal E. Murray, Carl Radens +1 more 2007-10-16
7279413 High-temperature stable gate structure with metallic electrode Dae-Gyu Park, Oleg Gluschenkov, Michael A. Gribelyuk 2007-10-09
7270884 Adhesion layer for Pt on SiO2 Jingyu Lian, Michael Wise, Young Limb, Nicolas Nagel 2007-09-18
7223691 Method of forming low resistance and reliable via in inter-level dielectric interconnect Cyril Cabral, Jr., Lawrence A. Clevenger, Timothy J. Dalton, Patrick W. DeHaven, Chester T. Dziobkowski +4 more 2007-05-29
7208414 Method for enhanced uni-directional diffusion of metal and subsequent silicide formation Anthony G. Domenicucci, Bradley P. Jones, Christian Lavoie, Robert J. Purtell, Yun-Yu Wang 2007-04-24
7193500 Thin film resistors of different materials Anil K. Chinthakindi, Anita Madan, Kenneth J. Stein 2007-03-20
7112502 Method to fabricate passive components using conductive polymer Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Li-Kong Wang 2006-09-26
7105445 Interconnect structures with encasing cap and methods of making thereof Louis C. Hsu, Timothy J. Dalton, Carl Radens, Chih-Chao Yang, Lawrence A. Clevenger +1 more 2006-09-12
7101784 Method to generate porous organic dielectric Lawrence A. Clevenger, Stephen E. Greco, Keith Kwietniak, Soon-Cheon Seo, Chih-Chao Yang +1 more 2006-09-05
7087997 Copper to aluminum interlayer interconnect using stud and via liner Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee +6 more 2006-08-08
7088074 System level device for battery and integrated circuit integration Lawrence A. Clevenger, Louis L. Hsu, Carl Radens, Li-Kong Wang 2006-08-08
7078247 Early detection of contact liner integrity by chemical reaction Lawrence Bauer, Jr., Kenneth J. Giewont, Subramanian S. Iyer, Bosang Kim, Jeffrey Lloyd +4 more 2006-07-18