| 9423665 |
Ambient light adjustment apparatus, method and system |
Hsueh-Chin Lin, Yi-Shou Tsai, Chih-Chia Chang, Wei-Chen Pao, Kuo-Chung Huang +2 more |
2016-08-23 |
|
| 9357955 |
Portable analytical device and system |
Hui-Hsin Lu, Sheng-Po Wang, Mao-Yin Wang, Kuan-Hung Chou, Ching-Kai Peng +2 more |
2016-06-07 |
|
| 9288907 |
Microelectronic 3D packaging structure and method of manufacturing the same |
Shao-Chung Hu, Kuo-Yang Horng, Ling-Yueh Yang, Wei-Ching Liu, Pen-Shan Chao +1 more |
2016-03-15 |
|
| 9219023 |
3D chip stack having encapsulated chip-in-chip |
Mukta G. Farooq, Kangguo Cheng |
2015-12-22 |
$977,000 |
| 9035465 |
Forming semiconductor chip connections |
Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons |
2015-05-19 |
$4,677,000 |
| 8841200 |
Simultaneously forming a through silicon via and a deep trench structure |
Kangguo Cheng, Mukta G. Farooq |
2014-09-23 |
$6,171,000 |
| 8802497 |
Forming semiconductor chip connections |
Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons |
2014-08-12 |
$3,643,000 |
| 8790989 |
Modularized three-dimensional capacitor array |
Xu Ouyang, Chih-Chao Yang |
2014-07-29 |
$5,690,000 |
| 8772156 |
Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications |
William R. Tonti, Chih-Chao Yang |
2014-07-08 |
$4,236,000 |
| 8692375 |
Interconnect structure containing various capping materials for programmable electrical fuses |
William R. Tonti, Chih-Chao Yang |
2014-04-08 |
$7,562,000 |
| 8687445 |
Self-repair integrated circuit and repair method |
Rajiv V. Joshi, Zhijian Yang, Ping-Chuan Wang |
2014-04-01 |
$5,095,000 |
| 8624395 |
Redundancy design with electro-migration immunity and method of manufacture |
Conal E. Murray, Ping-Chuan Wang, Chih-Chao Yang |
2014-01-07 |
$4,729,000 |
| 8580646 |
Method of fabricating field effect transistors with low k sidewall spacers |
Kangguo Cheng, Jack A. Mandelman, William R. Tonti |
2013-11-12 |
$8,268,000 |
| 8558384 |
Interconnect structure containing various capping materials for electrical fuse and other related applications |
William R. Tonti, Chih-Chao Yang |
2013-10-15 |
$3,582,000 |
| 8536632 |
FinFET with reduced gate to fin overlay sensitivity |
Kangguo Cheng, Jack A. Mandelman, John E. Sheets, II |
2013-09-17 |
$4,204,000 |
| 8518767 |
FinFET with reduced gate to fin overlay sensitivity |
Kangguo Cheng, Jack A. Mandelman, John E. Sheets, II |
2013-08-27 |
$5,858,000 |
| 8492241 |
Method for simultaneously forming a through silicon via and a deep trench structure |
Kangguo Cheng, Mukta G. Farooq |
2013-07-23 |
$2,085,000 |
| 8487696 |
Modularized three-dimensional capacitor array |
Xu Ouyang, Chih-Chao Yang |
2013-07-16 |
$5,283,000 |
| 8471356 |
Programmable anti-fuse structures with conductive material islands |
Kangguo Cheng, William R. Tonti, Chih-Chao Yang |
2013-06-25 |
$6,528,000 |
| 8450205 |
Redundancy design with electro-migration immunity and method of manufacture |
Conal E. Murray, Ping-Chuan Wang, Chih-Chao Yang |
2013-05-28 |
$7,454,000 |
| 8422322 |
Self-repair integrated circuit and repair method |
Rajiv V. Joshi, Zhijian Yang, Ping-Chuan Wang |
2013-04-16 |
$3,567,000 |
| 8351166 |
Leakage sensor and switch device for deep-trench capacitor array |
Howard H. Chen, Kai D. Feng, Seongwon Kim |
2013-01-08 |
$4,312,000 |
| 8324102 |
Techniques for impeding reverse engineering |
Rajiv V. Joshi, David W. Kruger |
2012-12-04 |
$3,998,000 |
| 8236610 |
Forming semiconductor chip connections |
Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons |
2012-08-07 |
$7,112,000 |
| 8232649 |
Structure for interconnect structure containing various capping materials for electrical fuse and other related applications |
William R. Tonti, Chih-Chao Yang |
2012-07-31 |
$5,473,000 |
