Issued Patents All Time
Showing 25 most recent of 471 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9423665 | Ambient light adjustment apparatus, method and system | Hsueh-Chin Lin, Yi-Shou Tsai, Chih-Chia Chang, Wei-Chen Pao, Kuo-Chung Huang +2 more | 2016-08-23 |
| 9357955 | Portable analytical device and system | Hui-Hsin Lu, Sheng-Po Wang, Mao-Yin Wang, Kuan-Hung Chou, Ching-Kai Peng +2 more | 2016-06-07 |
| 9288907 | Microelectronic 3D packaging structure and method of manufacturing the same | Shao-Chung Hu, Kuo-Yang Horng, Ling-Yueh Yang, Wei-Ching Liu, Pen-Shan Chao +1 more | 2016-03-15 |
| 9219023 | 3D chip stack having encapsulated chip-in-chip | Mukta G. Farooq, Kangguo Cheng | 2015-12-22 |
| 9035465 | Forming semiconductor chip connections | Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons | 2015-05-19 |
| 8841200 | Simultaneously forming a through silicon via and a deep trench structure | Kangguo Cheng, Mukta G. Farooq | 2014-09-23 |
| 8802497 | Forming semiconductor chip connections | Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons | 2014-08-12 |
| 8790989 | Modularized three-dimensional capacitor array | Xu Ouyang, Chih-Chao Yang | 2014-07-29 |
| 8772156 | Methods of fabricating interconnect structures containing various capping materials for electrical fuse and other related applications | William R. Tonti, Chih-Chao Yang | 2014-07-08 |
| 8692375 | Interconnect structure containing various capping materials for programmable electrical fuses | William R. Tonti, Chih-Chao Yang | 2014-04-08 |
| 8687445 | Self-repair integrated circuit and repair method | Rajiv V. Joshi, Zhijian Yang, Ping-Chuan Wang | 2014-04-01 |
| 8624395 | Redundancy design with electro-migration immunity and method of manufacture | Conal E. Murray, Ping-Chuan Wang, Chih-Chao Yang | 2014-01-07 |
| 8580646 | Method of fabricating field effect transistors with low k sidewall spacers | Kangguo Cheng, Jack A. Mandelman, William R. Tonti | 2013-11-12 |
| 8558384 | Interconnect structure containing various capping materials for electrical fuse and other related applications | William R. Tonti, Chih-Chao Yang | 2013-10-15 |
| 8536632 | FinFET with reduced gate to fin overlay sensitivity | Kangguo Cheng, Jack A. Mandelman, John E. Sheets, II | 2013-09-17 |
| 8518767 | FinFET with reduced gate to fin overlay sensitivity | Kangguo Cheng, Jack A. Mandelman, John E. Sheets, II | 2013-08-27 |
| 8492241 | Method for simultaneously forming a through silicon via and a deep trench structure | Kangguo Cheng, Mukta G. Farooq | 2013-07-23 |
| 8487696 | Modularized three-dimensional capacitor array | Xu Ouyang, Chih-Chao Yang | 2013-07-16 |
| 8471356 | Programmable anti-fuse structures with conductive material islands | Kangguo Cheng, William R. Tonti, Chih-Chao Yang | 2013-06-25 |
| 8450205 | Redundancy design with electro-migration immunity and method of manufacture | Conal E. Murray, Ping-Chuan Wang, Chih-Chao Yang | 2013-05-28 |
| 8422322 | Self-repair integrated circuit and repair method | Rajiv V. Joshi, Zhijian Yang, Ping-Chuan Wang | 2013-04-16 |
| 8351166 | Leakage sensor and switch device for deep-trench capacitor array | Howard H. Chen, Kai D. Feng, Seongwon Kim | 2013-01-08 |
| 8324102 | Techniques for impeding reverse engineering | Rajiv V. Joshi, David W. Kruger | 2012-12-04 |
| 8236610 | Forming semiconductor chip connections | Kangguo Cheng, Timothy J. Dalton, Mukta G. Farooq, John A. Fitzsimmons | 2012-08-07 |
| 8232649 | Structure for interconnect structure containing various capping materials for electrical fuse and other related applications | William R. Tonti, Chih-Chao Yang | 2012-07-31 |