Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10884735 | Instruction and logic for predication and implicit destination | Jayesh Iyer, Jamison D. Collins, Sebastian Winkel | 2021-01-05 |
| 10725755 | Systems, apparatuses, and methods for a hardware and software system to automatically decompose a program to multiple parallel threads | David J. Sager, Ruchira Sasanka, Ron Gabor, Shlomo Raikin, Joseph Nuzman +10 more | 2020-07-28 |
| 9916164 | Methods and apparatus to optimize instructions for execution by a processor | Vineeth Mekkat, Girish Venkatasubramanian | 2018-03-13 |
| 9904546 | Instruction and logic for predication and implicit destination | Jayesh Iyer, Jamison D. Collins, Sebastian Winkel | 2018-02-27 |
| 9672019 | Systems, apparatuses, and methods for a hardware and software system to automatically decompose a program to multiple parallel threads | David J. Sager, Ruchira Sasanka, Ron Gabor, Shlomo Raikin, Joseph Nuzman +10 more | 2017-06-06 |
| 8598641 | Sea-of-fins structure on a semiconductor substrate and method of fabrication | Louis C. Hsu, Jack A. Mandelman, Chun-Yung Sung | 2013-12-03 |
| 8416121 | Narrow-band wide-range frequency modulation continuous wave (FMCW) radar system | Kai D. Feng, Duixian Liu | 2013-04-09 |
| 8351166 | Leakage sensor and switch device for deep-trench capacitor array | Kai D. Feng, Louis L. Hsu, Seongwon Kim | 2013-01-08 |
| 8189419 | Apparatus for nonvolatile multi-programmable electronic fuse system | John A. Fifield, Louis C. Hsu | 2012-05-29 |
| 8138085 | Laser annealing for 3-D chip integration | Louis C. Hsu, Lawrence S. Mok, J. Campbell Scott | 2012-03-20 |
| 8129609 | Integrated thermoelectric cooling devices and methods for fabricating same | Richard C. Chu, Louis L. Hsu | 2012-03-06 |
| 8086988 | Chip design and fabrication method optimized for profit | Nathan C. Buck, James Eckhardt, Eric A. Foreman, James C. Gregerson, Peter A. Habitz +3 more | 2011-12-27 |
| 8076190 | Sea-of-fins structure on a semiconductor substrate and method of fabrication | Louis C. Hsu, Jack A. Mandelman, Chun-Yung Sung | 2011-12-13 |
| 8004097 | Carrier wafer having alignment keys and supporting a chip | Louis L. Hsu | 2011-08-23 |
| 7947566 | Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate | Louis L. Hsu, Jack A. Mandelman | 2011-05-24 |
| 7947599 | Laser annealing for 3-D chip integration | Louis C. Hsu, Lawrence S. Mok, J. Campbell Scott | 2011-05-24 |
| 7867820 | Methods for forming co-planar wafer-scale chip packages | Lloyd Burrell, Louis L. Hsu, Wolfgang Sauter | 2011-01-11 |
| 7736949 | Device and method for fabricating double-sided SOI wafer scale package with optical through via connections | Louis L. Hsu | 2010-06-15 |
| 7675789 | Programmable heavy-ion sensing device for accelerated DRAM soft error detection | John A. Fifield, Louis L. Hsu, Henry H. K. Tang | 2010-03-09 |
| 7676775 | Method to determine the root causes of failure patterns by using spatial correlation of tester data | Katherine V. Hawkins, Fook-Luen Heng, Louis C. Hsu, Xu Ouyang | 2010-03-09 |
| 7544883 | Integrated thermoelectric cooling devices and methods for fabricating same | Richard C. Chu, Louis L. Hsu | 2009-06-09 |
| 7528483 | Cooling system for a semiconductor device and method of fabricating same | Louis L. Hsu, Joseph F. Shepard, Jr. | 2009-05-05 |
| 7499308 | Programmable heavy-ion sensing device for accelerated DRAM soft error detection | John A. Fifield, Louis L. Hsu, Henry H. K. Tang | 2009-03-03 |
| 7489025 | Device and method for fabricating double-sided SOI wafer scale package with optical through via connections | Louis L. Hsu | 2009-02-10 |
| 7442579 | Methods to achieve precision alignment for wafer scale packages | Louis L. Hsu | 2008-10-28 |