Issued Patents All Time
Showing 25 most recent of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9058887 | Reprogrammable electrical fuse | Conal E. Murray, Chandrasekhar Narayan, Chih-Chao Yang | 2015-06-16 |
| 8772941 | Circuit structure with low dielectric constant regions | Lawrence A. Clevenger, Matthew E. Colburn, Wai-Kin Li | 2014-07-08 |
| 8759175 | Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof | Xu Ouyang, Ping-Chuan Wang, Zhijian Yang | 2014-06-24 |
| 8598641 | Sea-of-fins structure on a semiconductor substrate and method of fabrication | Howard H. Chen, Jack A. Mandelman, Chun-Yung Sung | 2013-12-03 |
| 8471296 | FinFET fuse with enhanced current crowding | Kangguo Cheng, William R. Tonti, Chih-Chao Yang | 2013-06-25 |
| 8339893 | Dual beta ratio SRAM | Yuen H. Chan, Xu Ouyang, Robert C. Wong | 2012-12-25 |
| 8304912 | Structure and method for MOSFET gate electrode landing pad | Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens, Kwong Hon Wong, Chih-Chao Yang | 2012-11-06 |
| 8193575 | Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof | Xu Ouyang, Ping-Chuan Wang, Zhijian Yang | 2012-06-05 |
| 8189419 | Apparatus for nonvolatile multi-programmable electronic fuse system | Howard H. Chen, John A. Fifield | 2012-05-29 |
| 8169077 | Dielectric interconnect structures and methods for forming the same | Chih-Chao Yang, Rajiv V. Joshi | 2012-05-01 |
| 8159042 | Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application | Chih-Chao Yang, Lawrence A. Clevenger, Timothy J. Dalton, Nicholas C. M. Fuller | 2012-04-17 |
| 8138085 | Laser annealing for 3-D chip integration | Howard H. Chen, Lawrence S. Mok, J. Campbell Scott | 2012-03-20 |
| 8105936 | Methods for forming dielectric interconnect structures | Chih-Chao Yang, Rajiv V. Joshi | 2012-01-31 |
| 8093657 | Circuit and methods to improve the operation of SOI devices | Roy C. Flaker, Jente B. Kuang | 2012-01-10 |
| 8076190 | Sea-of-fins structure on a semiconductor substrate and method of fabrication | Howard H. Chen, Jack A. Mandelman, Chun-Yung Sung | 2011-12-13 |
| 8027415 | Data communications systems | James S. Mason, Phil J. Murfet, Gareth John Nicholls | 2011-09-27 |
| 8027416 | Structure for data communications systems | James S. Mason, Phil J. Murfet, Gareth John Nicholls | 2011-09-27 |
| 8009461 | SRAM device, and SRAM device design structure, with adaptable access transistors | Xu Ouyang | 2011-08-30 |
| 7968944 | Integrated circuit chip with FETs having mixed body thicknesses and method of manufacture thereof | Rajiv V. Joshi, Oleg Gluschenkov | 2011-06-28 |
| 7947599 | Laser annealing for 3-D chip integration | Howard H. Chen, Lawrence S. Mok, J. Campbell Scott | 2011-05-24 |
| 7927995 | Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application | Chih-Chao Yang, Lawrence A. Clevenger, Timothy J. Dalton, Nicholas C. M. Fuller | 2011-04-19 |
| 7911025 | Fuse/anti-fuse structure and methods of making and programming same | Rajiv V. Joshi, Jack A. Mandelman, Chih-Chao Yang | 2011-03-22 |
| 7906428 | Modified via bottom structure for reliability enhancement | Lawrence A. Clevenger, Timothy J. Dalton, Conal E. Murray, Carl Radens, Kwong Hon Wong +1 more | 2011-03-15 |
| 7902061 | Interconnect structures with encasing cap and methods of making thereof | Lawrence A. Clevenger, Timothy J. Dalton, Carl Radens, Theodorus E. Standaert, Keith Kwong Hon Wong +1 more | 2011-03-08 |
| 7821051 | MIM capacitor and method of fabricating same | Chih-Chao Yang, Lawrence A. Clevenger, Timothy J. Dalton | 2010-10-26 |