Issued Patents All Time
Showing 25 most recent of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347530 | Expert-in-the-loop AI for materials generation | Petar Ristoski, Dmitry Zubarev, Linda Ha Kato, Anna Lisa Gentile, Nathaniel H. Park +6 more | 2025-07-01 |
| 12135927 | Expert-in-the-loop AI for materials discovery | Petar Ristoski, Dmitry Zubarev, Linda Ha Kato, Anna Lisa Gentile, Nathaniel H. Park +6 more | 2024-11-05 |
| 11663273 | Cognitive horizon surveillance | Daniel Gruhl, Linda Ha Kato, Petar Ristoski, Steven R. Welch, Chad Eric DeLuca +4 more | 2023-05-30 |
| 10486268 | Damage-free self-limiting through-substrate laser ablation | Fuad E. Doany | 2019-11-26 |
| 9640765 | Carbon nanotube device | Lawrence A. Clevenger, Gregory A. Northrop, Carl Radens, Brian C. Sapp | 2017-05-02 |
| 9576836 | Damage-free self-limiting through-substrate laser ablation | Fuad E. Doany | 2017-02-21 |
| 9406888 | Carbon nanotube device | Lawrence A. Clevenger, Gregory A. Northrop, Carl Radens, Brian C. Sapp | 2016-08-02 |
| 9058887 | Reprogrammable electrical fuse | Louis C. Hsu, Conal E. Murray, Chih-Chao Yang | 2015-06-16 |
| 8829986 | Structure and method for integrated synaptic element | Lawrence A. Clevenger, Gregory A. Northrop, Carl Radens, Brian C. Sapp | 2014-09-09 |
| 8463723 | Electronic synapse | Dharmendra S. Modha, John C. Scott | 2013-06-11 |
| 8416537 | Recording head with tilted orientation | David Berman, Robert G. Biskeborn, Michel Despont, Philipp Herget, Wayne Isami Imaino +2 more | 2013-04-09 |
| 7804148 | Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer | Louis L. Hsu, Jack A. Mandelman, Chun-Yung Sung | 2010-09-28 |
| 7564118 | Chip and wafer integration process using vertical connections | H. Bernhard Pogge, Roy Yu, Chandrika Prasad | 2009-07-21 |
| 7534651 | Seedless wirebond pad plating | Kevin S. Petrarca | 2009-05-19 |
| 7486845 | Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter | Charles T. Black, Gian-Luca Bona, Timothy J. Dalton, Nicholas C. M. Fuller, Roland Germann +2 more | 2009-02-03 |
| 7388277 | Chip and wafer integration process using vertical connections | H. Bernhard Pogge, Roy Yu, Chandrika Prasad | 2008-06-17 |
| 7298935 | Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitter | Charles T. Black, Gian-Luca Bona, Timothy J. Dalton, Nicholas C. M. Fuller, Roland Germann +2 more | 2007-11-20 |
| 7298639 | Reprogrammable electrical fuse | Louis C. Hsu, Conal E. Murray, Chih-Chao Yang | 2007-11-20 |
| 7115997 | Seedless wirebond pad plating | Kevin S. Petrarca | 2006-10-03 |
| 7084479 | Line level air gaps | Shyng-Tsong Chen, Stefanie Chiras, Matthew E. Colburn, Timothy J. Dalton, Jeffrey Hedrick +9 more | 2006-08-01 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7030481 | High density chip carrier with integrated passive devices | Michael P. Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce K. Furman, Rajarao Jammy +3 more | 2006-04-18 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6962872 | High density chip carrier with integrated passive devices | Michael P. Chudzik, Robert H. Dennard, Rama Divakaruni, Bruce K. Furman, Rajarao Jammy +3 more | 2005-11-08 |
| 6927472 | Fuse structure and method to form the same | David K. Anderson, Tien-Jen Cheng, Timothy J. Dalton, Christopher V. Jahnes, Andrew Lu +3 more | 2005-08-09 |