Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6081021 | Conductor-insulator-conductor structure | Jeffrey P. Gambino, Toshiaki Kirihata | 2000-06-27 |
| 6063651 | Method for activating fusible links on a circuit substrate | Daniel C. Edelstein | 2000-05-16 |
| 6037648 | Semiconductor structure including a conductive fuse and process for fabrication thereof | Kenneth C. Arndt, Jeffrey P. Gambino, Jack A. Mandelman, Rainer Florian Schnabel, Ronald J. Schutz +1 more | 2000-03-14 |
| 6029881 | Micro-scale part positioning by surface interlocking | Pedro A. Chalco, Bruce K. Furman, Raymond R. Horton | 2000-02-29 |
| 6008523 | Electrical fuses with tight pitches and method of fabrication in semiconductors | Axel Brintzinger, Gabriel Daniel, Fred L. Einspruch | 1999-12-28 |
| 5948286 | Diffusion bonding of lead interconnections using precise laser-thermosonic energy | Pedro A. Chalco, Raymond R. Horton, Michael J. Palmer | 1999-09-07 |
| 5939335 | Method for reducing stress in the metallization of an integrated circuit | Kenneth C. Arndt, Richard A. Conti, David M. Dobuzinsky, Laertis Economikos, Jeffrey P. Gambino +1 more | 1999-08-17 |
| 5818563 | Substrate structure and assembly method for reduced spatial light modulator size | Evan G. Colgan, Robert L. Melcher, Teruhiro Nakasogi, James L. Sanford, Kei-Hsiung Yang | 1998-10-06 |
| 5793836 | X-ray mask pellicle | Juan R. Maldonado, Raul E. Acosta, Marie Angelopoulos, Fuad E. Doany, Andrew T. S. Pomerene +2 more | 1998-08-11 |
| 5764314 | Mechanical packaging and thermal management of flat mirror arrays | Evan G. Colgan, Kei-Hsiung Yang, Robert L. Melcher, Lawrence S. Mok, Leathen Shi +1 more | 1998-06-09 |
| 5721602 | Mechanical packaging and thermal management of flat mirror arrays | Evan G. Colgan, Kei-Hsiung Yang, Robert L. Melcher, Lawrence S. Mok, Leathen Shi +1 more | 1998-02-24 |
| 5687078 | Fine pitch bonding | Raymond R. Horton, Michael J. Palmer | 1997-11-11 |
| 5659153 | Thermoformed three dimensional wiring module | Jane M. Shaw | 1997-08-19 |
| 5641114 | Controlled temperature bonding | Raymond R. Horton, Michael J. Palmer | 1997-06-24 |
| 5619357 | Flat panel display containing black matrix polymer | Marie Angelopoulos, Ali Afzali-Ardakani, Claudius Feger | 1997-04-08 |
| 5569950 | Device to monitor and control the temperature of electronic chips to enhance reliability | David Lewis | 1996-10-29 |
| 5534094 | Method for fabricating multi-layer thin film structure having a separation layer | Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt +7 more | 1996-07-09 |
| 5471090 | Electronic structures having a joining geometry providing reduced capacitive loading | Alina Deutsch, David Lewis, Anthony L. Plachy | 1995-11-28 |
| 5420073 | Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal | Giulio DiGiacomo, Jung-Ihl Kim, Sampath Purushothaman | 1995-05-30 |
| 5392177 | Sealed DASD having humidity control and method of making same | Timothy J. Chainer, Emanuel I. Cooper, Suryanarayan G. Hegde | 1995-02-21 |
| 5367195 | Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal | Giulio DiGiacomo, Jung-Ihl Kim, Sampath Purushothaman | 1994-11-22 |
| 5258236 | Multi-layer thin film structure and parallel processing method for fabricating same | Gnanalingam Arjavalingam, Alina Deutsch, Fuad E. Doany, Bruce K. Furman, Donald J. Hunt +7 more | 1993-11-02 |
| 5167913 | Method of forming an adherent layer of metallurgy on a ceramic substrate | John Acocella, Philip L. Flaitz, Raj N. Master, Sarah H. Knickerbocker, Paul H. Palmateer +2 more | 1992-12-01 |
| 4985310 | Multilayered metallurgical structure for an electronic component | Birendra Agarwala, Keith F. Beckman, Alice H. Cooper-Joselow, Sampath Purushothaman, Sudipta K. Ray | 1991-01-15 |