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Process for forming a multi-level thin-film electronic packaging structure |
Chandrika Prasad, Roy Yu, Richard L. Canull, Ajay P. Giri, Lewis S. Goldmann +6 more |
2004-01-20 |
| 6656770 |
Thermal enhancement approach using solder compositions in the liquid state |
Eugene Atwood, Joseph A. Benenati, Horatio Quinones |
2003-12-02 |
| 6373133 |
Multi-chip module and heat-sink cap combination |
Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more |
2002-04-16 |
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Pb-In-Sn tall C-4 for fatigue enhancement |
— |
2001-12-11 |
| 6281573 |
Thermal enhancement approach using solder compositions in the liquid state |
Eugene Atwood, Joseph A. Benenati, Horatio Quinones |
2001-08-28 |
| 6281452 |
Multi-level thin-film electronic packaging structure and related method |
Chandrika Prasad, Roy Yu, Richard L. Canull, Ajay P. Giri, Lewis S. Goldmann +6 more |
2001-08-28 |
| 6196443 |
Pb-In-Sn tall C-4 for fatigue enhancement |
— |
2001-03-06 |
| 6085831 |
Direct chip-cooling through liquid vaporization heat exchange |
Sushumna Iruvanti, David J. Womac |
2000-07-11 |
| 6025649 |
Pb-In-Sn tall C-4 for fatigue enhancement |
— |
2000-02-15 |
| 5981310 |
Multi-chip heat-sink cap assembly |
Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti, Raed A. Sherif +4 more |
1999-11-09 |
| 5950907 |
Ternary solder for the enhancement of C-4 fatigue life |
— |
1999-09-14 |
| 5831336 |
Ternary solder for the enhancement of C-4 fatigue life |
— |
1998-11-03 |
| 5539186 |
Temperature controlled multi-layer module |
Anthony J. Abrami, Maurizio Arienzo, Gene J. Gaudenzi, Paul V. McLaughlin |
1996-07-23 |
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Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Armando S. Cammarano, Nunzio DiPaolo |
1995-08-15 |
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Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
Jung-Ihl Kim, Chandrasekhar Narayan, Sampath Purushothaman |
1995-05-30 |
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Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
Jung-Ihl Kim, Chandrasekhar Narayan, Sampath Purushothaman |
1994-11-22 |
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Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Armando S. Cammarano, Nunzio DiPaolo |
1993-11-30 |
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Low-cost ternary composite for use in vias in glass-ceramic structures |
Armando S. Cammarano, Nunzio DiPaolo |
1993-03-09 |
| 5175609 |
Structure and method for corrosion and stress-resistant interconnecting metallurgy |
Armando S. Cammarano, Nunzio DiPaolo |
1992-12-29 |
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Process for brazing |
Armando S. Cammarano |
1984-08-14 |
| 4360289 |
Pin for brazing to a substrate and improved package resulting therefrom |
Armando S. Cammarano |
1982-11-23 |
| 4272722 |
Determination of electric current flow patterns |
Armando S. Cammarano, Stephen S. Drofitz, Jr. |
1981-06-09 |
