RY

Roy Yu

IBM: 42 patents #2,200 of 70,183Top 4%
Overall (All Time): #73,272 of 4,157,543Top 2%
42
Patents All Time

Issued Patents All Time

Showing 25 most recent of 42 patents

Patent #TitleCo-InventorsDate
11458717 Four D device process and structure Wilfried E. Haensch 2022-10-04
10011098 Four D device process and structure Wilfried E. Haensch 2018-07-03
9259902 4D Device, process and structure Wilfried E. Haensch 2016-02-16
8247895 4D device process and structure Wilfried E. Haensch 2012-08-21
7821120 Metal filled through via structure for providing vertical wafer-to-wafer interconnection H. Bernhard Pogge 2010-10-26
7566632 Lock and key structure for three-dimensional chip connection and process thereof Mary B. Rothwell, Ghavam G. Shahidi 2009-07-28
7564118 Chip and wafer integration process using vertical connections H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan 2009-07-21
7388277 Chip and wafer integration process using vertical connections H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan 2008-06-17
7354798 Three-dimensional device fabrication method H. Bernhard Pogge 2008-04-08
7344959 Metal filled through via structure for providing vertical wafer-to-wafer interconnection H. Bernhard Pogge 2008-03-18
7071031 Three-dimensional integrated CMOS-MEMS device and process for making the same H. Bernhard Pogge, Michel Despont, Ute Drechsler, Peter Vettiger 2006-07-04
7049697 Process for making fine pitch connections between devices and structure made by the process H. Bernhard Pogge, Chandrika Prasad 2006-05-23
6998327 Thin film transfer join process and multilevel thin film module Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Oonk, Chandrika Prasad +1 more 2006-02-14
6864165 Method of fabricating integrated electronic chip with an interconnect device H. Bernhard Pogge, Chandrika Prasad 2005-03-08
6856025 Chip and wafer integration process using vertical connections H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan 2005-02-15
6835589 Three-dimensional integrated CMOS-MEMS device and process for making the same H. Bernhard Pogge, Michel Despont, Ute Drechsler, Chandrika Prasad, Peter Vettiger 2004-12-28
6737297 Process for making fine pitch connections between devices and structure made by the process H. Bernhard Pogge, Chandrika Prasad 2004-05-18
6678949 Process for forming a multi-level thin-film electronic packaging structure Chandrika Prasad, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more 2004-01-20
6640021 Fabrication of a hybrid integrated circuit device including an optoelectronic chip H. Bernhard Pogge, Chandrika Prasad 2003-10-28
6599778 Chip and wafer integration process using vertical connections H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan 2003-07-29
6600224 Thin film attachment to laminate using a dendritic interconnection Donald S. Farquhar, Raymond T. Galasco, Sung Kwon Kang, Mark D. Poliks, Chandrika Prasad 2003-07-29
6455331 Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly, Yeeling L. Lee +3 more 2002-09-24
6448169 Apparatus and method for use in manufacturing semiconductor devices William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more 2002-09-10
6444560 Process for making fine pitch connections between devices and structure made by the process H. Bernhard Pogge, Chandrika Prasad 2002-09-03
6331731 Column for module component Kimberley A. Kelly 2001-12-18