| 11458717 |
Four D device process and structure |
Wilfried E. Haensch |
2022-10-04 |
$9,590,000 |
| 10011098 |
Four D device process and structure |
Wilfried E. Haensch |
2018-07-03 |
$3,207,000 |
| 9259902 |
4D Device, process and structure |
Wilfried E. Haensch |
2016-02-16 |
$2,821,000 |
| 8247895 |
4D device process and structure |
Wilfried E. Haensch |
2012-08-21 |
$4,162,000 |
| 7821120 |
Metal filled through via structure for providing vertical wafer-to-wafer interconnection |
H. Bernhard Pogge |
2010-10-26 |
$4,266,000 |
| 7566632 |
Lock and key structure for three-dimensional chip connection and process thereof |
Mary B. Rothwell, Ghavam G. Shahidi |
2009-07-28 |
$11,761,000 |
| 7564118 |
Chip and wafer integration process using vertical connections |
H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan |
2009-07-21 |
$14,996,000 |
| 7388277 |
Chip and wafer integration process using vertical connections |
H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan |
2008-06-17 |
$10,894,000 |
| 7354798 |
Three-dimensional device fabrication method |
H. Bernhard Pogge |
2008-04-08 |
$6,866,000 |
| 7344959 |
Metal filled through via structure for providing vertical wafer-to-wafer interconnection |
H. Bernhard Pogge |
2008-03-18 |
$8,037,000 |
| 7071031 |
Three-dimensional integrated CMOS-MEMS device and process for making the same |
H. Bernhard Pogge, Michel Despont, Ute Drechsler, Peter Vettiger |
2006-07-04 |
|
| 7049697 |
Process for making fine pitch connections between devices and structure made by the process |
H. Bernhard Pogge, Chandrika Prasad |
2006-05-23 |
$5,226,000 |
| 6998327 |
Thin film transfer join process and multilevel thin film module |
Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Oonk, Chandrika Prasad +1 more |
2006-02-14 |
$5,958,000 |
| 6864165 |
Method of fabricating integrated electronic chip with an interconnect device |
H. Bernhard Pogge, Chandrika Prasad |
2005-03-08 |
$6,470,000 |
| 6856025 |
Chip and wafer integration process using vertical connections |
H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan |
2005-02-15 |
$11,729,000 |
| 6835589 |
Three-dimensional integrated CMOS-MEMS device and process for making the same |
H. Bernhard Pogge, Michel Despont, Ute Drechsler, Chandrika Prasad, Peter Vettiger |
2004-12-28 |
$11,084,000 |
| 6737297 |
Process for making fine pitch connections between devices and structure made by the process |
H. Bernhard Pogge, Chandrika Prasad |
2004-05-18 |
$9,414,000 |
| 6678949 |
Process for forming a multi-level thin-film electronic packaging structure |
Chandrika Prasad, Richard L. Canull, Giulio DiGiacomo, Ajay P. Giri, Lewis S. Goldmann +6 more |
2004-01-20 |
$10,094,000 |
| 6640021 |
Fabrication of a hybrid integrated circuit device including an optoelectronic chip |
H. Bernhard Pogge, Chandrika Prasad |
2003-10-28 |
$14,845,000 |
| 6599778 |
Chip and wafer integration process using vertical connections |
H. Bernhard Pogge, Chandrika Prasad, Chandrasekhar Narayan |
2003-07-29 |
$10,466,000 |
| 6600224 |
Thin film attachment to laminate using a dendritic interconnection |
Donald S. Farquhar, Raymond T. Galasco, Sung Kwon Kang, Mark D. Poliks, Chandrika Prasad |
2003-07-29 |
$10,466,000 |
| 6455331 |
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly, Yeeling L. Lee +3 more |
2002-09-24 |
$8,983,000 |
| 6448169 |
Apparatus and method for use in manufacturing semiconductor devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more |
2002-09-10 |
$13,066,000 |
| 6444560 |
Process for making fine pitch connections between devices and structure made by the process |
H. Bernhard Pogge, Chandrika Prasad |
2002-09-03 |
$9,688,000 |
| 6331731 |
Column for module component |
Kimberley A. Kelly |
2001-12-18 |
$52,171,000 |
