Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6455331 | Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2002-09-24 | $8,983,000 |
| 6248599 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2001-06-19 | $38,179,000 |
| 6048741 | Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices | Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more | 2000-04-11 | $38,584,000 |