| 9804498 |
Filtering lead from photoresist stripping solution |
Charles L. Arvin, Harry D. Cox, Jennifer D. Schuler |
2017-10-31 |
$5,356,000 |
| 7683493 |
Intermetallic diffusion block device and method of manufacture |
Charles L. Arvin, Carla A. Bailey, Harry D. Cox, Hua Gan, Hsichang Liu +3 more |
2010-03-23 |
$4,775,000 |
| 7294909 |
Electronic package repair process |
Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more |
2007-11-13 |
$7,366,000 |
| 6916670 |
Electronic package repair process |
Jon A. Casey, James G. Balz, Michael Berger, Jerome D. Cohen, Charles J. Hendricks +13 more |
2005-07-12 |
$9,006,000 |
| 6541709 |
Inherently robust repair process for thin film circuitry using uv laser |
Peter A. Franklin, Rajesh S. Patel, Thomas A. Wassick |
2003-04-01 |
$11,931,000 |
| 6455331 |
Process of top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more |
2002-09-24 |
$8,983,000 |
| 6448169 |
Apparatus and method for use in manufacturing semiconductor devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more |
2002-09-10 |
$13,066,000 |
| 6427324 |
Inherently robust repair process for thin film circuitry using UV laser |
Peter A. Franklin, Rajesh S. Patel, Thomas A. Wassick |
2002-08-06 |
$5,918,000 |
| 6248599 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more |
2001-06-19 |
$38,179,000 |
| 6149048 |
Apparatus and method for use in manufacturing semiconductor devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more |
2000-11-21 |
$39,339,000 |
| 6099935 |
Apparatus for providing solder interconnections to semiconductor and electronic packaging devices |
William Brearley, Laertis Economikos, Paul F. Findeis, Kimberley A. Kelly, Bouwe W. Leenstra +4 more |
2000-08-08 |
$34,993,000 |
| 6054749 |
Thin film device repaired using enhanced repair process |
Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, John R. Pennacchia, Kurt A. Smith +3 more |
2000-04-25 |
$26,364,000 |
| 6048741 |
Top-surface-metallurgy plate-up bonding and rewiring for multilayer devices |
Roy Yu, Kamalesh S. Desai, Peter A. Franklin, Suryanarayana Kaja, Kimberley A. Kelly +3 more |
2000-04-11 |
$38,584,000 |
| 5972723 |
Enhanced thin film wiring net repair process |
Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, John R. Pennacchia, Kurt A. Smith +3 more |
1999-10-26 |
$20,157,000 |
| 5937269 |
Graphics assisted manufacturing process for thin-film devices |
Roy Yu, Gerald K. Bartley, Peter A. Franklin, Carmine J. Mele, John R. Pennacchia +3 more |
1999-08-10 |
$20,467,000 |
| 5735452 |
Ball grid array by partitioned lamination process |
Roy Yu, William Brearley, Kimberley A. Kelly, Patrick M. O'Leary, James Wood |
1998-04-07 |
$12,123,000 |
| 5722579 |
Bottom-surface-metallurgy rework process in ceramic modules |
Roy Yu, James Wood, Thomas Michael Biruk, Gregory S. Boettcher, William Brearley +2 more |
1998-03-03 |
$13,090,000 |
