Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9254533 | Removing material from defective opening in glass mold | Robert Haas, Enrico Herz, Michael Teich, Christopher L. Tessler | 2016-02-09 |
| 8800952 | Removing material from defective opening in glass mold and related glass mold for injection molded solder | Robert Haas, Enrico Herz, Michael Teich, Christopher L. Tessler | 2014-08-12 |
| 8237086 | Removing material from defective opening in glass mold | Robert Haas, Enrico Herz, Michael Teich, Christopher L. Tessler | 2012-08-07 |
| 7294909 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Charles J. Hendricks, Richard F. Indyk +13 more | 2007-11-13 |
| 6916670 | Electronic package repair process | Jon A. Casey, James G. Balz, Michael Berger, Charles J. Hendricks, Richard F. Indyk +13 more | 2005-07-12 |