Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9254533 | Removing material from defective opening in glass mold | Jerome D. Cohen, Robert Haas, Michael Teich, Christopher L. Tessler | 2016-02-09 |
| 8800952 | Removing material from defective opening in glass mold and related glass mold for injection molded solder | Jerome D. Cohen, Robert Haas, Michael Teich, Christopher L. Tessler | 2014-08-12 |
| 8237086 | Removing material from defective opening in glass mold | Jerome D. Cohen, Robert Haas, Michael Teich, Christopher L. Tessler | 2012-08-07 |
| 8044320 | Method and apparatus for the correction of defective solder bump arrays | Michael Teich, Axel Becker | 2011-10-25 |