Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446442 | Integrated circuit chip with molding compound handler substrate and method | Shahid Butt | 2019-10-15 |
| 10090255 | Dicing channels for glass interposers | Brittany L. Hedrick, Vijay Sukumaran, Richard F. Indyk, Sarah H. Knickerbocker | 2018-10-02 |
| 9754823 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter | 2017-09-05 |
| 9748135 | Substrate including selectively formed barrier layer | Yuri M. Brovman, Brian M. Erwin, Nicholas A. Polomoff, Jennifer D. Schuler, Matthew E. Souter | 2017-08-29 |
| 9278401 | Fill head interface with combination vacuum pressure chamber | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, Peter A. Gruber +5 more | 2016-03-08 |
| 9254533 | Removing material from defective opening in glass mold | Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich | 2016-02-09 |
| 8800952 | Removing material from defective opening in glass mold and related glass mold for injection molded solder | Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich | 2014-08-12 |
| 8237086 | Removing material from defective opening in glass mold | Jerome D. Cohen, Robert Haas, Enrico Herz, Michael Teich | 2012-08-07 |
| 8123088 | Dispensing assembly with a controlled gas environment | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, John P. Karidis +1 more | 2012-02-28 |
| 8123089 | Dispensing assembly with an injector controlled gas environment | Glen N. Biggs, Russell A. Budd, Benjamin V. Fasano, John J. Garant, G. Gerard Gormley +2 more | 2012-02-28 |
| 7833897 | Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface | Sarah H. Knickerbocker, Sean A. Allen, John J. Garant, Jerry A. Gorrell, Phillip W. Palmatier | 2010-11-16 |
| 7513410 | Air bearing gap control for injection molded solder heads | Glen N. Biggs, Timothy J. Chainer, John P. Karidis, Dennis G. Manzer | 2009-04-07 |
| 7401637 | Pressure-only molten metal valving apparatus and method | Glen N. Biggs, John J. Garant, Peter A. Gruber, Bouwe W. Leenstra, Thomas Weiss | 2008-07-22 |
| 7332424 | Fluxless solder transfer and reflow process | Luc Belanger, Peter A. Gruber, Valerie Oberson | 2008-02-19 |
| 6973715 | Method of forming a multichip module having chips on two sides | Ajay P. Giri, Joseph M. Sullivan | 2005-12-13 |
| 6892781 | Method and apparatus for application of pressure to a workpiece by thermal expansion | Dale Curtis McHerron, Kaushal S. Patel, Jerry A. Gorrell, James Edward Tersigni | 2005-05-17 |
| 6765152 | Multichip module having chips on two sides | Ajay P. Giri, Joseph M. Sullivan | 2004-07-20 |
| 6413868 | Modular high frequency integrated circuit structure | Thomas A. Bartush, David L. Harame, John C. Malinowski, Dawn Tudryn Piciacchio, Richard P. Volant | 2002-07-02 |
| 6259148 | Modular high frequency integrated circuit structure | Thomas A. Bartush, David L. Harame, John C. Malinowski, Dawn Tudryn Piciacchio, Richard P. Volant | 2001-07-10 |
| 5905566 | Laser ablation top surface reference chuck | Ralph R. Comulada, Jr., Bouwe W. Leenstra | 1999-05-18 |
| 5609778 | Process for high contrast marking on surfaces using lasers | Doris Pulaski, Richard Anderson, Stephen J. Tirch, III, Dawn J. Tudryn | 1997-03-11 |