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Semiconductor structure with thin film resistor and terminal bond pad |
Fen Chen, Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, Anthony K. Stamper |
2016-03-15 |
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Self-healing crack stop structure |
Stephen P. Ayotte, Alissa R. Cote, Kendra A. Lyons, Benjamin J. Pierce |
2016-01-05 |
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Discontinuous guard ring |
Jeffrey P. Gambino, Mark D. Jaffe, Mark D. Levy |
2014-05-20 |
| 8563336 |
Method for forming thin film resistor and terminal bond pad simultaneously |
Fen Chen, Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, Anthony K. Stamper |
2013-10-22 |
| 8565510 |
Methods for reading a feature pattern from a packaged die |
John M. Cohn, Mark J. Flemming, Karl V. Swanke |
2013-10-22 |
| 8299609 |
Product chips and die with a feature pattern that contains information relating to the product chip |
John M. Cohn, Mark J. Flemming, Karl V. Swanke |
2012-10-30 |
| 8187897 |
Fabricating product chips and die with a feature pattern that contains information relating to the product chip |
John M. Cohn, Mark J. Flemming, Karl V. Swanke |
2012-05-29 |
| 7067914 |
Dual chip stack method for electro-static discharge protection of integrated circuits |
Edmund J. Sprogis, Steven H. Voldman |
2006-06-27 |
| 7053460 |
Multi-level RF passive device |
Richard P. Volant, Seshadri Subbanna, Robert A. Groves, Kenneth J. Stein, Kevin S. Petrarca |
2006-05-30 |
| 7025891 |
Method of polishing C4 molybdenum masks to remove molybdenum peaks |
Steven R. Codding, Timothy C. Krywanczyk, Joseph Danaher, James R. Palmer, Melvin T. Kelly +2 more |
2006-04-11 |
| 6656375 |
Selective nitride: oxide anisotropic etch process |
Michael D. Armacost, David M. Dobuzinsky, Hung Y. Ng, Richard S. Wise, Chienfan Yu |
2003-12-02 |
| 6656815 |
Process for implanting a deep subcollector with self-aligned photo registration marks |
Douglas D. Coolbaugh, Louis D. Lanzerotti |
2003-12-02 |
| 6413868 |
Modular high frequency integrated circuit structure |
Thomas A. Bartush, David L. Harame, Dawn Tudryn Piciacchio, Christopher L. Tessler, Richard P. Volant |
2002-07-02 |
| 6259148 |
Modular high frequency integrated circuit structure |
Thomas A. Bartush, David L. Harame, Dawn Tudryn Piciacchio, Christopher L. Tessler, Richard P. Volant |
2001-07-10 |
| 5204280 |
Process for fabricating multiple pillars inside a dram trench for increased capacitor surface |
Sang Hoo Dhong |
1993-04-20 |