Issued Patents All Time
Showing 25 most recent of 72 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10900923 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2021-01-26 |
| 10794948 | Electromigration monitor | Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more | 2020-10-06 |
| 10677833 | Electromigration monitor | Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more | 2020-06-09 |
| 10545111 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2020-01-28 |
| 10545110 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2020-01-28 |
| 10388567 | Thru-silicon-via structures | Mukta G. Farooq, Carole D. Graas, Xiao Hu Liu | 2019-08-20 |
| 10324056 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2019-06-18 |
| 10309919 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2019-06-04 |
| 10141274 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-11-27 |
| 10126260 | Moisture detection and ingression monitoring systems and methods of manufacture | Jeffrey P. Gambino, Carole D. Graas, Wen Liu, Prakash Periasamy | 2018-11-13 |
| 9891261 | Electromigration monitor | Mukta G. Farooq, John A. Griesemer, Chandrasekaran Kothandaraman, John M. Safran, Timothy D. Sullivan +2 more | 2018-02-13 |
| 9893023 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2018-02-13 |
| 9851398 | Via leakage and breakdown testing | Roger A. Dufresne, Charles W. Griffin, Kevin Kolvenbach | 2017-12-26 |
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Cathryn J. Christiansen, Deborah M. Massey, Prakash Periasamy, Michael A. Shinosky | 2017-12-26 |
| 9812359 | Thru-silicon-via structures | Mukta G. Farooq, Carole D. Graas, Xiao Hu Liu | 2017-11-07 |
| 9780031 | Wiring structures | Cathryn J. Christiansen, Roger A. Dufresne, Charles W. Griffin | 2017-10-03 |
| 9711464 | Semiconductor chip with anti-reverse engineering function | Edward C. Cooney, III, Jonathan M. Pratt, Jason P. Ritter, Patrick S. Spinney, Anna Tilley | 2017-07-18 |
| 9613853 | Copper wire and dielectric with air gaps | Jeffrey P. Gambino, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2017-04-04 |
| 9453873 | Non-planar field effect transistor test structure and lateral dielectric breakdown testing method | Roger A. Dufresne, Kevin Kolvenbach, Michael A. Shinosky | 2016-09-27 |
| 9404953 | Structures and methods for monitoring dielectric reliability with through-silicon vias | Mukta G. Farooq, John A. Griesemer, Chandrasekharan Kothandaraman, John M. Safran, Timothy D. Sullivan | 2016-08-02 |
| 9318414 | Integrated circuit structure with through-semiconductor via | Minhua Lu, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang | 2016-04-19 |
| 9318413 | Integrated circuit structure with metal cap and methods of fabrication | Andrew Tae Kim, Minhua Lu, Timothy D. Sullivan, Ping-Chuan Wang, Lijuan Zhang | 2016-04-19 |
| 9287345 | Semiconductor structure with thin film resistor and terminal bond pad | Jeffrey P. Gambino, Zhong-Xiang He, Tom C. Lee, John C. Malinowski, Anthony K. Stamper | 2016-03-15 |
| 9230914 | Copper wire and dielectric with air gaps | Jeffrey P. Gambino, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2016-01-05 |
| 9159671 | Copper wire and dielectric with air gaps | Jeffrey P. Gambino, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2015-10-13 |