Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9851398 | Via leakage and breakdown testing | Fen Chen, Roger A. Dufresne, Kevin Kolvenbach | 2017-12-26 |
| 9780031 | Wiring structures | Fen Chen, Cathryn J. Christiansen, Roger A. Dufresne | 2017-10-03 |
| 7927105 | Method and system for creating and delivering prescriptive learning | Marla A. Haddon, Biao Luo, John R. Malpass, Benjamin J. Montello | 2011-04-19 |
| 7560950 | Packaging reliability superchips | Jason E. Blanchet, James V. Crain, Jr., David B. Stone, Robert F. White | 2009-07-14 |
| 7348792 | Packaging reliability super chips | Jason E. Blanchet, James V. Crain, Jr., David B. Stone, Robert F. White | 2008-03-25 |
| 7102377 | Packaging reliability superchips | Jason E. Blanchet, James V. Crain, Jr., David B. Stone, Robert F. White | 2006-09-05 |
| 5898706 | Structure and method for reliability stressing of dielectrics | Roger A. Dufresne, Chorng-Lii Hwang, William A. Klaasen, Alvin W. Strong | 1999-04-27 |