Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11841296 | Semiconductor substrates for electrical resistivity measurements | Marvin Montaque, Katherine Niles, Timothy W. Kemerer | 2023-12-12 |
| 10770407 | IC structure with interdigitated conductive elements between metal guard structures | Zhuojie Wu, Erdem Kaltalioglu, Ping-Chuan Wang, Ronald G. Filippi, Eric D. Hunt-Schroeder +1 more | 2020-09-08 |
| 10475677 | Parallel test structure | Tian Shen, Anil Kumar, Yuncheng Song, Kong Boon Yeap, Ronald G. Filippi +3 more | 2019-11-12 |
| 10297546 | Interconnect structures for a security application | Erdem Kaltalioglu, Ronald G. Filippi, Ping-Chuan Wang | 2019-05-21 |
| 10109599 | Integrated circuit structure with continuous metal crack stop | Anthony K. Stamper, Tom C. Lee, Ian McCallum-Cook | 2018-10-23 |
| 9851397 | Electromigration testing of interconnect analogues having bottom-connected sensory pins | Fen Chen, Deborah M. Massey, Prakash Periasamy, Michael A. Shinosky | 2017-12-26 |
| 9831194 | Edge compression layers | Tom C. Lee, Ian McCallum-Cook, Anthony K. Stamper | 2017-11-28 |
| 9780031 | Wiring structures | Fen Chen, Roger A. Dufresne, Charles W. Griffin | 2017-10-03 |
| 9768065 | Interconnect structures with variable dopant levels | Ping-Chuan Wang, Erdem Kaltalioglu, Ronald G. Filippi | 2017-09-19 |
| 9685370 | Titanium tungsten liner used with copper interconnects | Jonathan D. Chapple-Sokol, Jeffrey P. Gambino, Tom C. Lee, William J. Murphy, Anthony K. Stamper | 2017-06-20 |
| 9435852 | Integrated circuit (IC) test structure with monitor chain and test wires | Andrew Tae Kim, Ping-Chuan Wang | 2016-09-06 |
| 9214427 | Method of self-correcting power grid for semiconductor structures | Andrew H. Norfleet, Kirk D. Peterson, Andrew A. Turner | 2015-12-15 |
| 9087841 | Self-correcting power grid for semiconductor structures method | Andrew H. Norfleet, Kirk D. Peterson, Andrew A. Turner | 2015-07-21 |
| 9059052 | Alternating open-ended via chains for testing via formation and dielectric integrity | Fen Chen, Roger A. Dufresne | 2015-06-16 |
| 8562210 | Thermal sensor for semiconductor circuits | Wagdi W. Abadeer, John A. Fifield, Dimitris P. Ioannou, Tom C. Lee | 2013-10-22 |
| 8383507 | Method for fabricating air gap interconnect structures | Kaushik Chanda, Daniel C. Edelstein, Satyanarayana V. Nitta, Son V. Nguyen, Shom Ponoth +1 more | 2013-02-26 |
| 8232809 | Determining critical current density for interconnect | Chad M. Burke, Baozhen Li | 2012-07-31 |
| 8120179 | Air gap interconnect structures and methods for forming the same | Kaushik Chanda, Daniel C. Edelstein, Satyanarayana V. Nitta, Son V. Nguyen, Shom Ponoth +1 more | 2012-02-21 |
| 8018017 | Thermo-mechanical cleavable structure | Fen Chen, Richard S. Kontra, Tom C. Lee, Alvin W. Strong, Timothy D. Sullivan +1 more | 2011-09-13 |
| 7843062 | Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Michael A. Shinosky, Timothy D. Sullivan | 2010-11-30 |
| 7709401 | Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperature | Fen Chen, Michael A. Shinosky, Timothy D. Sullivan | 2010-05-04 |