Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11881441 | Stacked die semiconductor package spacer die | Sireesha Gogineni, Yong She, Karissa J. Blue | 2024-01-23 |
| 11647681 | Fabrication of phase change memory cell in integrated circuit | Baozhen Li, Chih-Chao Yang, Barry P. Linder | 2023-05-09 |
| 11489118 | Reliable resistive random access memory | Baozhen Li, Chih-Chao Yang, Ernest Y. Wu | 2022-11-01 |
| 11276748 | Switchable metal insulator metal capacitor | Baozhen Li, Chih-Chao Yang, Barry P. Linder | 2022-03-15 |
| 11133462 | Bottom electrode structure and method of forming the same | Chih-Chao Yang, Baozhen Li | 2021-09-28 |
| 11121082 | Sub-ground rule e-Fuse structure | Baozhen Li, Chih-Chao Yang, Ernest Y. Wu | 2021-09-14 |
| 10971447 | BEOL electrical fuse | Chih-Chao Yang, Baozhen Li | 2021-04-06 |
| 10930589 | Advanced interconnects containing an IMT liner | Joseph F. Maniscalco, Baozhen Li, Chih-Chao Yang | 2021-02-23 |
| 10903117 | Fabricating vias with lower resistance | Baozhen Li, Chih-Chao Yang | 2021-01-26 |
| 10840447 | Fabrication of phase change memory cell in integrated circuit | Baozhen Li, Chih-Chao Yang, Barry P. Linder | 2020-11-17 |
| 10811353 | Sub-ground rule e-Fuse structure | Baozhen Li, Chih-Chao Yang, Ernest Y. Wu | 2020-10-20 |
| 10770393 | BEOL thin film resistor | Baozhen Li, Ernest Y. Wu, Chih-Chao Yang | 2020-09-08 |
| 10741441 | Collar formation for chamfer-less and chamfered vias | Baozhen Li, Chih-Chao Yang | 2020-08-11 |
| 10651083 | Graded interconnect cap | Baozhen Li, Ernest Y. Wu, Chih-Chao Yang | 2020-05-12 |
| 10615112 | MIM capacitor for improved process defect tolerance | Baozhen Li, Chih-Chao Yang | 2020-04-07 |
| 10468346 | Advanced interconnects containing an IMT liner | Joseph F. Maniscalco, Baozhen Li, Chih-Chao Yang | 2019-11-05 |
| 10325862 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang | 2019-06-18 |
| 10304783 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Chengwen Pei, Ping-Chuan Wang | 2019-05-28 |
| 10262934 | Three plate MIM capacitor via integrity verification | Baozhen Li, Barry P. Linder, Ernest Y. Wu | 2019-04-16 |
| 10229873 | Three plate MIM capacitor via integrity verification | Baozhen Li, Barry P. Linder, Ernest Y. Wu | 2019-03-12 |
| 9852999 | Wafer reinforcement to reduce wafer curvature | Erdem Kaltalioglu, Chengwen Pei, Ping-Chuan Wang | 2017-12-26 |
| 9817063 | Interconnect reliability structures | Ping-Chuan Wang, Ronald G. Filippi | 2017-11-14 |
| 9761539 | Wafer rigidity with reinforcement structure | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang | 2017-09-12 |
| 9478509 | Mechanically anchored backside C4 pad | Ronald G. Filippi, Erdem Kaltalioglu, Ping-Chuan Wang, Lijuan Zhang | 2016-10-25 |
| 9435852 | Integrated circuit (IC) test structure with monitor chain and test wires | Cathryn J. Christiansen, Ping-Chuan Wang | 2016-09-06 |