Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349597 | Conical magnetic random access memory pillar structures | Oscar van der Straten, Koichi Motoyama, Chih-Chao Yang | 2025-07-01 |
| 12342726 | Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM) | Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2025-06-24 |
| 12317752 | MRAM structure with multilayer encapsulation | Oscar van der Straten, Koichi Motoyama, Chih-Chao Yang | 2025-05-27 |
| 12167700 | Replacement bottom electrode structure for MRAM devices | Oscar van der Straten, Koichi Motoyama, Chih-Chao Yang | 2024-12-10 |
| 12108685 | Multi-diameter magnetic random-access memory pillar structure | Oscar van der Straten, Koichi Motoyama, Chih-Chao Yang | 2024-10-01 |
| 12040230 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2024-07-16 |
| 11758819 | Magneto-resistive random access memory with laterally-recessed free layer | Oscar van der Straten, Koichi Motoyama, Kenneth Chun Kuen Cheng, Chih-Chao Yang | 2023-09-12 |
| 11682471 | Dual damascene crossbar array for disabling a defective resistive switching device in the array | Oscar van der Straten, Koichi Motoyama, Choonghyun Lee, Seyoung Kim | 2023-06-20 |
| 11664271 | Dual damascene with short liner | Koichi Motoyama, Oscar van der Straten, Alexander Reznicek, Raghuveer R. Patlolla, Theodorus E. Standaert | 2023-05-30 |
| 11430690 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2022-08-30 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Kenneth Chun Kuen Cheng, Koichi Motoyama, Brent A. Anderson | 2022-03-22 |
| 11183455 | Interconnects with enlarged contact area | Koichi Motoyama, Oscar van der Straten, Kenneth Chun Kuen Cheng | 2021-11-23 |
| 11177171 | Encapsulated top via interconnects | Oscar van der Straten, Kenneth Chun Kuen Cheng, Koichi Motoyama | 2021-11-16 |
| 11158538 | Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap | Koichi Motoyama, Oscar van der Straten, Scott A. DeVries, Alexander Reznicek | 2021-10-26 |
| 11069566 | Hybrid sidewall barrier facilitating low resistance interconnection | Oscar van der Straten, Koichi Motoyama, Scott A. DeVries | 2021-07-20 |
| 10950493 | Interconnects having air gap spacers | Kenneth Chun Kuen Cheng, Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2021-03-16 |
| 10930589 | Advanced interconnects containing an IMT liner | Andrew Tae Kim, Baozhen Li, Chih-Chao Yang | 2021-02-23 |
| 10903116 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Koichi Motoyama, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2021-01-26 |
| 10840325 | Low resistance metal-insulator-metal capacitor electrode | Koichi Motoyama, Oscar van der Straten, Chih-Chao Yang | 2020-11-17 |
| 10741748 | Back end of line metallization structures | Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-08-11 |
| 10686126 | Back end of line metallization structures | Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang | 2020-06-16 |
| 10546815 | Low resistance interconnect structure with partial seed enhancement liner | Oscar van der Straten, Koichi Motoyama, Alexander Reznicek | 2020-01-28 |
| 10529622 | Void-free metallic interconnect structures with self-formed diffusion barrier layers | Koichi Motoyama, James J. Kelly, Hosadurga Shobha, Chih-Chao Yang | 2020-01-07 |
| 10468346 | Advanced interconnects containing an IMT liner | Andrew Tae Kim, Baozhen Li, Chih-Chao Yang | 2019-11-05 |