Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406920 | Top via interconnect with airgap | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2025-09-02 |
| 12400912 | Dual-damascene fav interconnects with dielectric plug | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-08-26 |
| 12402329 | Top via containing random-access memory cross-bar array | Koichi Motoyama, Hsueh-Chung Chen, Chanro Park, Chih-Chao Yang | 2025-08-26 |
| 12356638 | Metal-insulator-metal capacitor structure with enlarged capacitor area | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-07-08 |
| 12341100 | Copper interconnects with self-aligned hourglass-shaped metal cap | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2025-06-24 |
| 12315807 | Reducing copper line resistance | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2025-05-27 |
| 12266607 | Bottom barrier free interconnects without voids | Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2025-04-01 |
| 12087624 | Beol tip-to-tip shorting and time dependent dielectric breakdown | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-09-10 |
| 12057395 | Top via interconnects without barrier metal between via and above line | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2024-08-06 |
| 12040230 | Encapsulated top via interconnects | Oscar van der Straten, Joseph F. Maniscalco, Koichi Motoyama | 2024-07-16 |
| 12027416 | BEOL etch stop layer without capacitance penalty | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-07-02 |
| 11972977 | Fabrication of rigid close-pitch interconnects | Chanro Park, Koichi Motoyama, Kisik Choi | 2024-04-30 |
| 11881431 | Anti-fuse with laterally extended liner | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2024-01-23 |
| 11848264 | Semiconductor structure with stacked vias having dome-shaped tips | Koichi Motoyama, Chanro Park, Alexander Reznicek | 2023-12-19 |
| 11758819 | Magneto-resistive random access memory with laterally-recessed free layer | Oscar van der Straten, Koichi Motoyama, Joseph F. Maniscalco, Chih-Chao Yang | 2023-09-12 |
| 11735475 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Koichi Motoyama, Nicholas Anthony Lanzillo | 2023-08-22 |
| 11430690 | Interconnects having air gap spacers | Koichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2022-08-30 |
| 11410879 | Subtractive back-end-of-line vias | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2022-08-09 |
| 11380641 | Pillar bump with noble metal seed layer for advanced heterogeneous integration | Joseph F. Maniscalco, Koichi Motoyama, Oscar van der Straten, Alexander Reznicek | 2022-07-05 |
| 11315872 | Self-aligned top via | Chanro Park, Koichi Motoyama, Kisik Choi, Chih-Chao Yang | 2022-04-26 |
| 11289375 | Fully aligned interconnects with selective area deposition | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2022-03-29 |
| 11282768 | Fully-aligned top-via structures with top-via trim | Koichi Motoyama, Brent A. Anderson, Joseph F. Maniscalco | 2022-03-22 |
| 11270913 | BEOL metallization formation | Chanro Park, Koichi Motoyama, Brent A. Anderson, Somnath Ghosh | 2022-03-08 |
| 11244854 | Dual damascene fully aligned via in interconnects | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2022-02-08 |
| 11244853 | Fully aligned via interconnects with partially removed etch stop layer | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2022-02-08 |