Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244897 | Back end of line metallization | Chanro Park, Koichi Motoyama, Somnath Ghosh, Chih-Chao Yang | 2022-02-08 |
| 11205591 | Top via interconnect with self-aligned barrier layer | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-12-21 |
| 11201112 | Fully-aligned skip-vias | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-12-14 |
| 11201056 | Pitch multiplication with high pattern fidelity | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-12-14 |
| 11183455 | Interconnects with enlarged contact area | Koichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco | 2021-11-23 |
| 11177214 | Interconnects with hybrid metal conductors | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-11-16 |
| 11177170 | Removal of barrier and liner layers from a bottom of a via | Chanro Park, Koichi Motoyama, Nicholas Anthony Lanzillo | 2021-11-16 |
| 11177171 | Encapsulated top via interconnects | Oscar van der Straten, Joseph F. Maniscalco, Koichi Motoyama | 2021-11-16 |
| 11177163 | Top via structure with enlarged contact area with upper metallization level | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2021-11-16 |
| 11177169 | Interconnects with gouged vias | Koichi Motoyama, Chih-Chao Yang, Hosadurga Shobha | 2021-11-16 |
| 11164815 | Bottom barrier free interconnects without voids | Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha, Joe Lee | 2021-11-02 |
| 11164774 | Interconnects with spacer structure for forming air-gaps | Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2021-11-02 |
| 11139202 | Fully aligned top vias with replacement metal lines | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-10-05 |
| 11127676 | Removal or reduction of chamfer for fully-aligned via | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-09-21 |
| 11094580 | Structure and method to fabricate fully aligned via with reduced contact resistance | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-08-17 |
| 11024577 | Embedded anti-fuses for small scale applications | Chanro Park, Koichi Motoyama, Chih-Chao Yang | 2021-06-01 |
| 10950493 | Interconnects having air gap spacers | Koichi Motoyama, Oscar van der Straten, Joseph F. Maniscalco, Chih-Chao Yang | 2021-03-16 |
| 10748812 | Air-gap containing metal interconnects | Koichi Motoyama, Kisik Choi, Chih-Chao Yang | 2020-08-18 |