Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400859 | Metal hard mask for precise tuning of mandrels | Yann Mignot, Christopher J. Penny, Koichi Motoyama | 2025-08-26 |
| 12266607 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha | 2025-04-01 |
| 12183634 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Thedorus E. Standaert | 2024-12-31 |
| 12033892 | Structure and method to improve FAV RIE process margin and electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2024-07-09 |
| 11837501 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2023-12-05 |
| 11721578 | Split ash processes for via formation to suppress damage to low-K layers | Yen-Tien Lu, Angelique Raley | 2023-08-08 |
| 11710658 | Structure and method to improve FAV RIE process margin and Electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2023-07-25 |
| 11257717 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2022-02-22 |
| 11164815 | Bottom barrier free interconnects without voids | Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha | 2021-11-02 |
| 11037822 | Svia using a single damascene interconnect | Yann Mignot, Muthumanickam Sankarapandian, Yongan Xu | 2021-06-15 |
| 10985056 | Structure and method to improve FAV RIE process margin and Electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2021-04-20 |
| 10957584 | Structure and method to improve FAV RIE process margin and electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2021-03-23 |
| 10832952 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2020-11-10 |
| 10672705 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Yann Mignot | 2020-06-02 |
| 10643859 | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication | Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki | 2020-05-05 |
| 10636706 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2020-04-28 |
| 10622301 | Method of forming a straight via profile with precise critical dimension control | Yongan Xu, Junli Wang, Yann Mignot | 2020-04-14 |
| 10347825 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang | 2019-07-09 |
| 10312434 | Selective deposition and nitridization of bottom electrode metal for MRAM applications | Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang | 2019-06-04 |
| 10276436 | Selective recessing to form a fully aligned via | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert | 2019-04-30 |
| 10211138 | Metal silicate spacers for fully aligned vias | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang | 2019-02-19 |
| 10170416 | Selective blocking boundary placement for circuit locations requiring electromigration short-length | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2019-01-01 |
| 10121676 | Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch | Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki | 2018-11-06 |
| 10049974 | Metal silicate spacers for fully aligned vias | Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang | 2018-08-14 |
| 10020254 | Integration of super via structure in BEOL | Ruqiang Bao, Yann Mignot, Hosadurga Shobha, Junli Wang, Yongan Xu | 2018-07-10 |