| 12400859 |
Metal hard mask for precise tuning of mandrels |
Yann Mignot, Christopher J. Penny, Koichi Motoyama |
2025-08-26 |
|
| 12266607 |
Bottom barrier free interconnects without voids |
Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha |
2025-04-01 |
|
| 12183634 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Thedorus E. Standaert |
2024-12-31 |
|
| 12033892 |
Structure and method to improve FAV RIE process margin and electromigration |
Benjamin D. Briggs, Theodorus E. Standaert |
2024-07-09 |
$11,082,000 |
| 11837501 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert |
2023-12-05 |
$9,771,000 |
| 11721578 |
Split ash processes for via formation to suppress damage to low-K layers |
Yen-Tien Lu, Angelique Raley |
2023-08-08 |
|
| 11710658 |
Structure and method to improve FAV RIE process margin and Electromigration |
Benjamin D. Briggs, Theodorus E. Standaert |
2023-07-25 |
$13,062,000 |
| 11257717 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert |
2022-02-22 |
$10,859,000 |
| 11164815 |
Bottom barrier free interconnects without voids |
Kenneth Chun Kuen Cheng, Koichi Motoyama, Kisik Choi, Cornelius Brown Peethala, Hosadurga Shobha |
2021-11-02 |
$2,126,000 |
| 11037822 |
Svia using a single damascene interconnect |
Yann Mignot, Muthumanickam Sankarapandian, Yongan Xu |
2021-06-15 |
$4,393,000 |
| 10985056 |
Structure and method to improve FAV RIE process margin and Electromigration |
Benjamin D. Briggs, Theodorus E. Standaert |
2021-04-20 |
$24,642,000 |
| 10957584 |
Structure and method to improve FAV RIE process margin and electromigration |
Benjamin D. Briggs, Theodorus E. Standaert |
2021-03-23 |
$27,105,000 |
| 10832952 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert |
2020-11-10 |
$12,559,000 |
| 10672705 |
Method of forming a straight via profile with precise critical dimension control |
Yongan Xu, Junli Wang, Yann Mignot |
2020-06-02 |
$2,290,000 |
| 10643859 |
Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication |
Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki |
2020-05-05 |
$3,712,000 |
| 10636706 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert |
2020-04-28 |
$8,182,000 |
| 10622301 |
Method of forming a straight via profile with precise critical dimension control |
Yongan Xu, Junli Wang, Yann Mignot |
2020-04-14 |
$1,668,000 |
| 10347825 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications |
Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang |
2019-07-09 |
$2,201,000 |
| 10312434 |
Selective deposition and nitridization of bottom electrode metal for MRAM applications |
Benjamin D. Briggs, Christopher J. Penny, Michael Rizzolo, Chih-Chao Yang |
2019-06-04 |
$2,774,000 |
| 10276436 |
Selective recessing to form a fully aligned via |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang, Theodorus E. Standaert |
2019-04-30 |
$3,198,000 |
| 10211138 |
Metal silicate spacers for fully aligned vias |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang |
2019-02-19 |
$3,019,000 |
| 10170416 |
Selective blocking boundary placement for circuit locations requiring electromigration short-length |
Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny |
2019-01-01 |
|
| 10121676 |
Interconnects fabricated by hydrofluorocarbon gas-assisted plasma etch |
Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki |
2018-11-06 |
$3,429,000 |
| 10049974 |
Metal silicate spacers for fully aligned vias |
Benjamin D. Briggs, Jessica Dechene, Elbert E. Huang |
2018-08-14 |
$4,051,000 |
| 10020254 |
Integration of super via structure in BEOL |
Ruqiang Bao, Yann Mignot, Hosadurga Shobha, Junli Wang, Yongan Xu |
2018-07-10 |
$4,870,000 |
