Issued Patents All Time
Showing 25 most recent of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400859 | Metal hard mask for precise tuning of mandrels | Joe Lee, Christopher J. Penny, Koichi Motoyama | 2025-08-26 |
| 12369494 | MRAM top electrode structure with liner layer | Hsueh-Chung Chen, Koichi Motoyama, Chanro Park, Chih-Chao Yang | 2025-07-22 |
| 12272545 | Embedded metal contamination removal from BEOL wafers | Devika Sil, Ashim Dutta, John C. Arnold, Daniel C. Edelstein, Kedari Matam +1 more | 2025-04-08 |
| 12243770 | Hard mask removal without damaging top epitaxial layer | Chanro Park, Daniel J. Vincent, Su Chen Fan, Christopher J. Waskiewicz, Hsueh-Chung Chen | 2025-03-04 |
| 12237175 | Polymerization protective liner for reactive ion etch in patterning | Bhaskar Nagabhirava, Phillip Friddle, Michael Goss, Dominik Metzler | 2025-02-25 |
| 12207477 | Same level MRAM stacks having different configurations | Oscar van der Straten, Dimitri Houssameddine | 2025-01-21 |
| 12191388 | Area scaling for VTFET contacts | Su Chen Fan, Jing Guo, Lijuan Zou | 2025-01-07 |
| 12148617 | Structure and method to pattern pitch lines | Chanro Park, Chi-Chun Liu, Stuart A. Sieg, Koichi Motoyama, Hsueh-Chung Chen | 2024-11-19 |
| 12142562 | Subtractive metal etch with improved isolation for BEOL interconnect and cross point | Chanro Park, Hsueh-Chung Chen | 2024-11-12 |
| 12142556 | X-ray shielding structure for a chip | Hsueh-Chung Chen, Mary Claire Silvestre, Effendi Leobandung | 2024-11-12 |
| 12113013 | Dual color via patterning | Hsueh-Chung Chen, Su Chen Fan, Mary Claire Silvestre, Chi-Chun Liu, Junli Wang | 2024-10-08 |
| 12094774 | Back-end-of-line single damascene top via spacer defined by pillar mandrels | Yongan Xu, Hsueh-Chung Chen | 2024-09-17 |
| 12033856 | Litho-litho-etch (LLE) multi color resist | Ekmini Anuja De Silva, Dario L. Goldfarb | 2024-07-09 |
| 12010930 | Wrap-around projection liner for AI device | Injo Ok, Hsueh-Chung Chen, Mary Claire Silvestre | 2024-06-11 |
| 11916013 | Via interconnects including super vias | Christopher J. Waskiewicz, Eric R. Miller, Chanro Park | 2024-02-27 |
| 11901440 | Sacrificial fin for self-aligned contact rail formation | Christopher J. Waskiewicz, Su Chen Fan, Brent A. Anderson, Junli Wang | 2024-02-13 |
| 11849647 | Nonmetallic liner around a magnetic tunnel junction | Tao Li, Ashim Dutta, Tsung-Sheng Kang, Wenyu Xu | 2023-12-19 |
| 11817389 | Multi-metal interconnects for semiconductor device structures | Hsueh-Chung Chen, Chih-Chao Yang, Shanti Pancharatnam | 2023-11-14 |
| 11804401 | Spacer-defined process for lithography-etch double patterning for interconnects | Nelson Felix, Ekmini Anuja De Silva, Luciana Meli Thompson | 2023-10-31 |
| 11798842 | Line formation with cut-first tip definition | Chanro Park, Koichi Motoyama, Hsueh-Chung Chen | 2023-10-24 |
| 11784120 | Metal via structure | James J. Kelly, Muthumanickam Sankarapandian, Yongan Xu, Hsueh-Chung Chen, Daniel J. Vincent | 2023-10-10 |
| 11688632 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2023-06-27 |
| 11670580 | Subtractive via etch for MIMCAP | Hsueh-Chung Chen, Junli Wang, Mary Claire Silvestre, Chi-Chun Liu | 2023-06-06 |
| 11646358 | Sacrificial fin for contact self-alignment | Indira Seshadri, Su Chen Fan, Christopher J. Waskiewicz, Eric R. Miller | 2023-05-09 |
| 11600325 | Non volatile resistive memory logic device | Hsueh-Chung Chen, Mary Claire Silvestre, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie +2 more | 2023-03-07 |