Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142556 | X-ray shielding structure for a chip | Hsueh-Chung Chen, Yann Mignot, Effendi Leobandung | 2024-11-12 |
| 12113013 | Dual color via patterning | Hsueh-Chung Chen, Yann Mignot, Su Chen Fan, Chi-Chun Liu, Junli Wang | 2024-10-08 |
| 12010930 | Wrap-around projection liner for AI device | Injo Ok, Hsueh-Chung Chen, Yann Mignot | 2024-06-11 |
| 12004436 | RRAM with high work function cap | Soon-Cheon Seo, Min Gyu Sung, Takashi Ando, Chanro Park, Xuefeng Liu | 2024-06-04 |
| 11670580 | Subtractive via etch for MIMCAP | Yann Mignot, Hsueh-Chung Chen, Junli Wang, Chi-Chun Liu | 2023-06-06 |
| 11600325 | Non volatile resistive memory logic device | Hsueh-Chung Chen, Soon-Cheon Seo, Chi-Chun Liu, Fee Li Lie, Chih-Chao Yang +2 more | 2023-03-07 |
| 11569134 | Wafer backside engineering for wafer stress control | Nikhil Jain, Hsueh-Chung Chen, Hosadurga Shobha | 2023-01-31 |
| 11075161 | Large via buffer | Yann Mignot, Hsueh-Chung Chen, Junli Wang, Chi-Chun Liu | 2021-07-27 |