Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11688632 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Yann Mignot +2 more | 2023-06-27 |
| 11164776 | Metallic interconnect structure | Son V. Nguyen, Takeshi Nogami, Thomas J. Haigh, Jr., Cornelius Brown Peethala | 2021-11-02 |
| 10923401 | Gate cut critical dimension shrink and active gate defect healing using selective deposition | Andrew M. Greene, Marc A. Bergendahl, Ekmini Anuja De Silva, Alex Joseph Varghese, Yann Mignot +2 more | 2021-02-16 |
| 10903111 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Yann Mignot +2 more | 2021-01-26 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Donald F. Canaperi, Spyridon Skordas, Binglin Miao +2 more | 2017-05-02 |
| 9607825 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-03-28 |
| 9558934 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-31 |
| 9558935 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-31 |
| 9536733 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2017-01-03 |
| 9449812 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Donald F. Canaperi, Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini +1 more | 2016-09-20 |
| 9312224 | Interconnect structure containing a porous low k interconnect dielectric/dielectric cap | Donald F. Canaperi, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Takeshi Nogami +2 more | 2016-04-12 |