Issued Patents All Time
Showing 25 most recent of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12208386 | 3D nanochannel interleaved devices | Lawrence A. Clevenger, Kangguo Cheng, Shawn P. Fetterolf | 2025-01-28 |
| 12100653 | Resistance tunable fuse structure formed by embedded thin metal layers | Alexander Reznicek, Chih-Chao Yang, Miaomiao Wang | 2024-09-24 |
| 11804378 | Surface conversion in chemical mechanical polishing | Raghuveer R. Patlolla, Cornelius Brown Peethala, Chih-Chao Yang, Mary Breton | 2023-10-31 |
| 11791398 | Nano multilayer carbon-rich low-k spacer | Richard A. Conti, Thomas J. Haigh, Jr., Eric R. Miller, Son V. Nguyen | 2023-10-17 |
| 11779918 | 3D nanochannel interleaved devices | Lawrence A. Clevenger, Kangguo Cheng, Shawn P. Fetterolf | 2023-10-10 |
| 11756786 | Forming high carbon content flowable dielectric film with low processing damage | Benjamin D. Briggs, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha +2 more | 2023-09-12 |
| 11738995 | Manipulation of a molecule using dipole moments | Lawrence A. Clevenger, Shawn P. Fetterolf, Kangguo Cheng | 2023-08-29 |
| 11676894 | Resistance tunable fuse structure formed by embedded thin metal layers | Alexander Reznicek, Chih-Chao Yang, Miaomiao Wang | 2023-06-13 |
| 11189783 | Embedded MRAM device formation with self-aligned dielectric cap | John C. Arnold, Dominik Metzler, Ashim Dutta | 2021-11-30 |
| 11154628 | Self-sterilizing sensor | Kangguo Cheng, Shawn P. Fetterolf, Lawrence A. Clevenger | 2021-10-26 |
| 11056418 | Semiconductor microcooler | Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2021-07-06 |
| 11049789 | Semiconductor microcooler | Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2021-06-29 |
| 11049727 | Interleaved structure for molecular manipulation | Lawrence A. Clevenger, Shawn P. Fetterolf, Kangguo Cheng | 2021-06-29 |
| 11031250 | Semiconductor structures of more uniform thickness | Mona A. Ebrish, Michael Rizzolo, Son V. Nguyen, Raghuveer R. Patlolla | 2021-06-08 |
| 10971675 | Dual function magnetic tunnel junction pillar encapsulation | Son V. Nguyen, Alexander Reznicek | 2021-04-06 |
| 10957642 | Resistance tunable fuse structure formed by embedded thin metal layers | Alexander Reznicek, Chih-Chao Yang, Miaomiao Wang | 2021-03-23 |
| 10937892 | Nano multilayer carbon-rich low-k spacer | Richard A. Conti, Thomas J. Haigh, Jr., Eric R. Miller, Son V. Nguyen | 2021-03-02 |
| 10937789 | Nanosheet eDRAM | Alexander Reznicek, Muthumanickam Sankarapandian, Keith E. Fogel | 2021-03-02 |
| 10832917 | Low oxygen cleaning for CMP equipment | Pavan S. Chinthamanipeta, Raghuveer R. Patlolla, Cornelius Brown Peethala | 2020-11-10 |
| 10553522 | Semiconductor microcooler | Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10553516 | Semiconductor microcooler | Daniel A. Corliss, Dario L. Goldfarb, Dinesh Gupta, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Daniel A. Corliss, Dinesh Gupta, Dario L. Goldfarb | 2019-11-26 |
| 10468585 | Dual function magnetic tunnel junction pillar encapsulation | Son V. Nguyen, Alexander Reznicek | 2019-11-05 |
| 10395986 | Fully aligned via employing selective metal deposition | Benjamin D. Briggs, James J. Kelly, Michael Rizzolo, Lawrence A. Clevenger | 2019-08-27 |