Issued Patents All Time
Showing 26–50 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10366928 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Zhenxing Bi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu | 2019-07-30 |
| 10242872 | Rework of patterned dielectric and metal hardmask films | John C. Arnold, Prasad Bhosale, Raghuveer R. Patlolla, Cornelius Brown Peethala, Hosadurga Shobha +1 more | 2019-03-26 |
| 10242882 | Cyclic etch process to remove dummy gate oxide layer for fin field effect transistor fabrication | Zhenxing Bi, Thamarai S. Devarajan, Sean Teehan | 2019-03-26 |
| 10224283 | Composite manganese nitride / low-k dielectric cap | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2019-03-05 |
| 10163721 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Zhenxing Bi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu | 2018-12-25 |
| 9997352 | Polysilicon residue removal in nanosheet MOSFETs | Zhenxing Bi, Thamarai S. Devarajan, Nicolas Loubet | 2018-06-12 |
| 9947622 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2018-04-17 |
| 9935015 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Zhenxing Bi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu | 2018-04-03 |
| 9754798 | Hybridization fin reveal for uniform fin reveal depth across different fin pitches | Zhenxing Bi, Thamarai S. Devarajan, Sivananda K. Kanakasabapathy, Fee Li Lie, Peng Xu | 2017-09-05 |
| 9711456 | Composite manganese nitride/low-K dielectric cap | Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini | 2017-07-18 |
| 9691705 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2017-06-27 |
| 9679780 | Polysilicon residue removal in nanosheet MOSFETs | Zhenxing Bi, Thamarai S. Devarajan, Nicolas Loubet | 2017-06-13 |
| 9640514 | Wafer bonding using boron and nitrogen based bonding stack | Wei Lin, Troy L. Graves-Abe, Spyridon Skordas, Matthew T. Shoudy, Binglin Miao +2 more | 2017-05-02 |
| 9607825 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more | 2017-03-28 |
| 9558934 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more | 2017-01-31 |
| 9558935 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more | 2017-01-31 |
| 9536733 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more | 2017-01-03 |
| 9472503 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2016-10-18 |
| 9466538 | Method to achieve ultra-high chip-to-chip alignment accuracy for wafer-to-wafer bonding process | Spyridon Skordas, Subramanian S. Iyer, Shidong Li, Wei Lin | 2016-10-11 |
| 9449812 | Hydrogen-free silicon-based deposited dielectric films for nano device fabrication | Alfred Grill, Sanjay C. Mehta, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha +1 more | 2016-09-20 |
| 9449810 | Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors | Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2016-09-20 |
| 9312224 | Interconnect structure containing a porous low k interconnect dielectric/dielectric cap | Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +2 more | 2016-04-12 |
| 9275874 | Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal | Kunaljeet Tanwar, Xunyuan Zhang, Raghuveer R. Patlolla | 2016-03-01 |
| 9275952 | Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects | Daniel C. Edelstein, Alfred Grill, Son V. Nguyen, Takeshi Nogami, Deepika Priyadarshini +1 more | 2016-03-01 |
| 9214332 | Composite dielectric materials with improved mechanical and electrical properties | Alfred Grill, Son V. Nguyen, Deepika Priyadarshini, Hosadurga Shobha | 2015-12-15 |