Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9558997 | Integration of Ru wet etch and CMP for beol interconnects with Ru layer | — | 2017-01-31 |
| 9343406 | Device having self-repair Cu barrier for solving barrier degradation due to Ru CMP | Xunyuan Zhang | 2016-05-17 |
| 9318437 | Moisture scavenging layer for thinner barrier application in beol integration | Ming He | 2016-04-19 |
| 9299745 | Integrated circuits having magnetic tunnel junctions (MTJ) and methods for fabricating the same | Xunyuan Zhang, Sean Xuan Lin | 2016-03-29 |
| 9275874 | Methods for fabricating integrated circuits using chemical mechanical planarization to recess metal | Xunyuan Zhang, Donald F. Canaperi, Raghuveer R. Patlolla | 2016-03-01 |
| 9087881 | Electroless fill of trench in semiconductor structure | Sean Xuan Lin, Xunyuan Zhang, Ming He, Larry Zhao, John A. Iacoponi | 2015-07-21 |
| 9076846 | Methods for fabricating integrated circuits using surface modification to selectively inhibit etching | Errol Todd Ryan, Xunyuan Zhang | 2015-07-07 |
| 9054052 | Methods for integration of pore stuffing material | Nicholas V. LiCausi, Errol Todd Ryan, Ming He, Moosung Chae, Larry Zhao +4 more | 2015-06-09 |
| 8962478 | Method to use self-repair Cu barrier to solve barrier degradation due to Ru CMP | Xunyuan Zhang | 2015-02-24 |
| 8932934 | Methods of self-forming barrier integration with pore stuffed ULK material | Moosung Chae, Errol Todd Ryan, Nicholas V. LiCausi, Christian Witt, Ailian Zhao +3 more | 2015-01-13 |
| 8883631 | Methods of forming conductive structures using a sacrificial material during a metal hard mask removal process | Xunyuan Zhang, Xiuyu Cai | 2014-11-11 |
| 8835306 | Methods for fabricating integrated circuits having embedded electrical interconnects | Errol Todd Ryan | 2014-09-16 |
| 8669176 | BEOL integration scheme for copper CMP to prevent dendrite formation | — | 2014-03-11 |
| 8586473 | Methods for fabricating integrated circuits with ruthenium-lined copper | Xunyuan Zhang, Ming He | 2013-11-19 |