| 12482704 |
Self-forming barrier for use in air gap formation |
Elbert E. Huang, Takeshi Nogami, Christopher J. Penny |
2025-11-25 |
|
| 12218003 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2025-02-04 |
|
| 12183634 |
Selective recessing to form a fully aligned via |
Jessica Dechene, Elbert E. Huang, Joe Lee, Thedorus E. Standaert |
2024-12-31 |
|
| 12087685 |
Semiconductor interconnect structure with double conductors |
Takeshi Nogami, Raghuveer R. Patlolla |
2024-09-10 |
$10,715,000 |
| 12055821 |
Structure and method of bi-layer pixel isolation in advanced LCOS back-plane |
Lan Yu, Tyler Sherwood, Zihao Yang |
2024-08-06 |
$90,312,000 |
| 12033892 |
Structure and method to improve FAV RIE process margin and electromigration |
Joe Lee, Theodorus E. Standaert |
2024-07-09 |
$11,082,000 |
| 11955424 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo |
2024-04-09 |
|
| 11908678 |
Method of CMP integration for improved optical uniformity in advanced LCOS back-plane |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan, Joseph F. Salfelder |
2024-02-20 |
$66,055,000 |
| 11881539 |
Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2024-01-23 |
$48,508,000 |
| 11880052 |
Structure and method of mirror grounding in LCoS devices |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2024-01-23 |
$48,508,000 |
| 11869783 |
Optimizating semiconductor binning by feed-forward process adjustment |
Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis |
2024-01-09 |
$9,963,000 |
| 11837501 |
Selective recessing to form a fully aligned via |
Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert |
2023-12-05 |
$9,771,000 |
| 11790072 |
Paint on micro chip touch screens |
Maryam Ashoori, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo +1 more |
2023-10-17 |
$7,011,000 |
| 11756786 |
Forming high carbon content flowable dielectric film with low processing damage |
Donald F. Canaperi, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha +2 more |
2023-09-12 |
$5,734,000 |
| 11735524 |
Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones |
Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo |
2023-08-22 |
$5,113,000 |
| 11710658 |
Structure and method to improve FAV RIE process margin and Electromigration |
Joe Lee, Theodorus E. Standaert |
2023-07-25 |
$13,062,000 |
| 11676854 |
Selective ILD deposition for fully aligned via with airgap |
Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha |
2023-06-13 |
$11,668,000 |
| 11636353 |
Cognitive system for localized LIDAR pollution detection using autonomous vehicles |
Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo |
2023-04-25 |
$8,760,000 |
| 11587830 |
Self-forming barrier for use in air gap formation |
Elbert E. Huang, Takeshi Nogami, Christopher J. Penny |
2023-02-21 |
$10,931,000 |
| 11586067 |
Structure and method of advanced LCoS back-plane having robust pixel via metallization |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2023-02-21 |
$24,540,000 |
| 11574864 |
Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device |
Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo |
2023-02-07 |
$5,433,000 |
| 11573452 |
Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes |
Lan Yu, Tyler Sherwood, Raghav Sreenivasan |
2023-02-07 |
$44,390,000 |
| 11488863 |
Self-aligned contact scheme for pillar-based memory elements |
Nicholas Anthony Lanzillo, Michael Rizzolo |
2022-11-01 |
$6,203,000 |
| 11348060 |
Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather |
Leigh Anne H. Clevenger, Aldis Sipolins, Michael Rizzolo, Lawrence A. Clevenger, Christopher J. Penny |
2022-05-31 |
$8,769,000 |
| 11348872 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration |
Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo |
2022-05-31 |
$8,769,000 |
