BB

Benjamin D. Briggs

IBM: 162 patents #252 of 70,183Top 1%
TE Tessera: 19 patents #21 of 271Top 8%
Applied Materials: 6 patents #1,918 of 7,310Top 30%
AS Adeia Semiconductor Solutions: 3 patents #3 of 57Top 6%
Overall (All Time): #3,751 of 4,157,543Top 1%
190
Patents All Time

Issued Patents All Time

Showing 25 most recent of 190 patents

Patent #TitleCo-InventorsDate
12218003 Selective ILD deposition for fully aligned via with airgap Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha 2025-02-04
12183634 Selective recessing to form a fully aligned via Jessica Dechene, Elbert E. Huang, Joe Lee, Thedorus E. Standaert 2024-12-31
12087685 Semiconductor interconnect structure with double conductors Takeshi Nogami, Raghuveer R. Patlolla 2024-09-10
12055821 Structure and method of bi-layer pixel isolation in advanced LCOS back-plane Lan Yu, Tyler Sherwood, Zihao Yang 2024-08-06
12033892 Structure and method to improve FAV RIE process margin and electromigration Joe Lee, Theodorus E. Standaert 2024-07-09
11955424 Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo 2024-04-09
11908678 Method of CMP integration for improved optical uniformity in advanced LCOS back-plane Lan Yu, Tyler Sherwood, Raghav Sreenivasan, Joseph F. Salfelder 2024-02-20
11881539 Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization Lan Yu, Tyler Sherwood, Raghav Sreenivasan 2024-01-23
11880052 Structure and method of mirror grounding in LCoS devices Lan Yu, Tyler Sherwood, Raghav Sreenivasan 2024-01-23
11869783 Optimizating semiconductor binning by feed-forward process adjustment Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Michael Rizzolo, Theodorus E. Standaert, James H. Stathis 2024-01-09
11837501 Selective recessing to form a fully aligned via Jessica Dechene, Elbert E. Huang, Joe Lee, Theodorus E. Standaert 2023-12-05
11790072 Paint on micro chip touch screens Maryam Ashoori, Justin A. Canaperi, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo +1 more 2023-10-17
11756786 Forming high carbon content flowable dielectric film with low processing damage Donald F. Canaperi, Huy Cao, Thomas J. Haigh, Jr., Son V. Nguyen, Hosadurga Shobha +2 more 2023-09-12
11735524 Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo 2023-08-22
11710658 Structure and method to improve FAV RIE process margin and Electromigration Joe Lee, Theodorus E. Standaert 2023-07-25
11676854 Selective ILD deposition for fully aligned via with airgap Christopher J. Penny, Huai Huang, Lawrence A. Clevenger, Michael Rizzolo, Hosadurga Shobha 2023-06-13
11636353 Cognitive system for localized LIDAR pollution detection using autonomous vehicles Lawrence A. Clevenger, Leigh Anne H. Clevenger, Michael Rizzolo 2023-04-25
11586067 Structure and method of advanced LCoS back-plane having robust pixel via metallization Lan Yu, Tyler Sherwood, Raghav Sreenivasan 2023-02-21
11587830 Self-forming barrier for use in air gap formation Elbert E. Huang, Takeshi Nogami, Christopher J. Penny 2023-02-21
11574864 Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo 2023-02-07
11573452 Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes Lan Yu, Tyler Sherwood, Raghav Sreenivasan 2023-02-07
11488863 Self-aligned contact scheme for pillar-based memory elements Nicholas Anthony Lanzillo, Michael Rizzolo 2022-11-01
11348872 Hybrid dielectric scheme for varying liner thickness and manganese concentration Lawrence A. Clevenger, Nicholas Anthony Lanzillo, Takeshi Nogami, Christopher J. Penny, Michael Rizzolo 2022-05-31
11348060 Increasing cost benefit and energy efficiency with modular delivery drones in inclement weather Leigh Anne H. Clevenger, Aldis Sipolins, Michael Rizzolo, Lawrence A. Clevenger, Christopher J. Penny 2022-05-31
11276636 Adjustable via dimension and chamfer angle Lawrence A. Clevenger, Koichi Motoyama, Gangadhara Raja Muthinti, Cornelius Brown Peethala, Michael Rizzolo 2022-03-15