| 12055821 |
Structure and method of bi-layer pixel isolation in advanced LCOS back-plane |
Lan Yu, Benjamin D. Briggs, Zihao Yang |
2024-08-06 |
| 12033964 |
Chemical mechanical polishing for copper dishing control |
Joseph F. Salfelder, Ki Cheol Ahn, Kai Ma, Raghav Sreenivasan, Jason Appell |
2024-07-09 |
| 11908678 |
Method of CMP integration for improved optical uniformity in advanced LCOS back-plane |
Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan, Joseph F. Salfelder |
2024-02-20 |
| 11880052 |
Structure and method of mirror grounding in LCoS devices |
Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan |
2024-01-23 |
| 11881539 |
Structure and method of advanced LCoS back-plane having highly reflective pixel via metallization |
Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan |
2024-01-23 |
| 11830824 |
Edge protection on semiconductor substrates |
Amirhasan Nourbakhsh, Lan Yu, Joseph F. Salfelder, Ki Cheol Ahn, Siddarth A. Krishnan +2 more |
2023-11-28 |
| 11769665 |
Power device structures and methods of making |
Amirhasan Nourbakhsh, Raman Gaire, Lan Yu, Roger QUON, Siddarth A. Krishnan |
2023-09-26 |
| 11705490 |
Graded doping in power devices |
Ashish Pal, El Mehdi Bazizi, Siddarth A. Krishnan, Xing Chen, Lan Yu |
2023-07-18 |
| 11605741 |
Methods of forming doped silicide power devices |
Joshua S. Holt, Lan Yu, Archana Kumar, Nicolas L. Breil, Siddarth A. Krishnan |
2023-03-14 |
| 11586067 |
Structure and method of advanced LCoS back-plane having robust pixel via metallization |
Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan |
2023-02-21 |
| 11573452 |
Method for LCoS DBR multilayer stack protection via sacrificial hardmask for RIE and CMP processes |
Lan Yu, Benjamin D. Briggs, Raghav Sreenivasan |
2023-02-07 |
| 11456171 |
Deep trench integration processes and devices |
Lan Yu |
2022-09-27 |
| 11410873 |
Deep trench integration processes and devices |
Lan Yu, Michael Chudzik, Siddarth A. Krishnan |
2022-08-09 |
