Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020255 | Integration of super via structure in BEOL | Ruqiang Bao, Yann Mignot, Hosadurga Shobha, Junli Wang, Yongan Xu | 2018-07-10 |
| 9953865 | Structure and method to improve FAV RIE process margin and electromigration | Benjamin D. Briggs, Theodorus E. Standaert | 2018-04-24 |
| 9934984 | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication | Robert L. Bruce, Eric A. Joseph, Takefumi Suzuki | 2018-04-03 |
| 9905513 | Selective blocking boundary placement for circuit locations requiring electromigration short-length | Benjamin D. Briggs, Elbert E. Huang, Christopher J. Penny | 2018-02-27 |
| 9768113 | Self aligned via in integrated circuit | Yannick Feurprier, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2017-09-19 |
| 9390967 | Method for residue-free block pattern transfer onto metal interconnects for air gap formation | Yann Mignot, Brown C. Peethala | 2016-07-12 |
| 9385078 | Self aligned via in integrated circuit | Yannick Feurprier, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-07-05 |
| 9373582 | Self aligned via in integrated circuit | Yannick Feurprier, Lars Liebmann, Yann Mignot, Terry A. Spooner, Douglas M. Trickett +1 more | 2016-06-21 |
| 9349687 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Stephen M. Gates, Elbert E. Huang, Son V. Nguyen, Brown C. Peethala, Christopher J. Penny +1 more | 2016-05-24 |
| 9252051 | Method for top oxide rounding with protection of patterned features | Yann Mignot, Douglas M. Trickett | 2016-02-02 |