Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10957588 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-03-23 |
| 10937694 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-03-02 |
| 10903118 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2021-01-26 |
| 10658176 | Methods of mitigating cobalt diffusion in contact structures and the resulting devices | Frank W. Mont, Han You, Shariq Siddiqui | 2020-05-19 |
| 10388565 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2019-08-20 |
| 10032668 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2018-07-24 |
| 9934980 | Rework and stripping of complex patterning layers using chemical mechanical polishing | Jassem A. Abdallah, Raghuveer R. Patlolla | 2018-04-03 |
| 9799559 | Methods employing sacrificial barrier layer for protection of vias during trench formation | Shariq Siddiqui, Frank W. Mont, Xunyuan Zhang, Douglas M. Trickett | 2017-10-24 |
| 9613862 | Chamferless via structures | Mark L. Lenhardt, Frank W. Mont, Shariq Siddiqui, Jessica P. Striss, Douglas M. Trickett | 2017-04-04 |
| 9508560 | SiARC removal with plasma etch and fluorinated wet chemical solution combination | Yann Mignot, Shariq Siddiqui | 2016-11-29 |
| 9390967 | Method for residue-free block pattern transfer onto metal interconnects for air gap formation | Joe Lee, Yann Mignot | 2016-07-12 |
| 9378966 | Selective etching of silicon wafer | Spyridon Skordas, Da Song, Allan Upham, Kevin R. Winstel | 2016-06-28 |
| 9373543 | Forming interconnect features with reduced sidewall tapering | Frank W. Mont, Shariq Siddiqui, Douglas M. Trickett | 2016-06-21 |
| 9349687 | Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnect | Stephen M. Gates, Elbert E. Huang, Joe Lee, Son V. Nguyen, Christopher J. Penny +1 more | 2016-05-24 |
| 9190285 | Rework and stripping of complex patterning layers using chemical mechanical polishing | Jassem A. Abdallah, Raghuveer R. Patlolla | 2015-11-17 |