Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2022-10-04 |
| 11458474 | Microfluidic chips with one or more vias | Joshua T. Smith, William Francis Landers, Teresa J. Wu | 2022-10-04 |
| 11322361 | Selective etching of silicon wafer | Da Song, Allan Upham, Cornelius Brown Peethala, Spyridon Skordas | 2022-05-03 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Ravi K. Bonam, Iqbal Rashid Saraf, Dario L. Goldfarb +2 more | 2021-03-02 |
| 10615139 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Spyridon Skordas | 2020-04-07 |
| 10211178 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Spyridon Skordas | 2019-02-19 |
| 10134577 | Edge trim processes and resultant structures | Richard F. Indyk, Deepika Priyadarshini, Spyridon Skordas, Edmund J. Sprogis, Anthony K. Stamper | 2018-11-20 |
| 10020279 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Spyridon Skordas | 2018-07-10 |
| 9620481 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2017-04-11 |
| 9553054 | Strain detection structures for bonded wafers and chips | Mukta G. Farooq, John A. Fitzsimmons, Erdem Kaltalioglu, Wei Lin, Spyridon Skordas | 2017-01-24 |
| 9543229 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Spyridon Skordas | 2017-01-10 |
| 9536853 | Semiconductor device including built-in crack-arresting film structure | Wei Lin, Leathen Shi, Spyridon Skordas | 2017-01-03 |
| 9536809 | Combination of TSV and back side wiring in 3D integration | Pooja R. Batra, John W. Golz, Subramanian S. Iyer, Douglas C. La Tulipe, Jr., Spyridon Skordas | 2017-01-03 |
| 9401303 | Handler wafer removal by use of sacrificial inert layer | Kangguo Cheng, Jonathan E. Faltermeier, Mukta G. Farooq, Wei Lin, Spyridon Skordas | 2016-07-26 |
| 9378966 | Selective etching of silicon wafer | Brown C. Peethala, Spyridon Skordas, Da Song, Allan Upham | 2016-06-28 |
| 9214435 | Via structure for three-dimensional circuit integration | Mukta G. Farooq, Troy L. Graves-Abe, Spyridon Skordas | 2015-12-15 |
| 9190303 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Wei Lin, Spyridon Skordas | 2015-11-17 |
| 9171749 | Handler wafer removal facilitated by the addition of an amorphous carbon layer on the handler wafer | Bing Dang, Sarah H. Knickerbocker, Douglas C. La Tulipe, Jr., Spyridon Skordas, Cornelia K. Tsang | 2015-10-27 |
| 9064937 | Substrate bonding with diffusion barrier structures | Daniel C. Edelstein, Douglas C. La Tulipe, Jr., Wei Lin, Deepika Priyadarshini, Spyridon Skordas +1 more | 2015-06-23 |
| 9059039 | Reducing wafer bonding misalignment by varying thermal treatment prior to bonding | Douglas C. La Tulipe, Jr., Wei Lin, Spyridon Skordas | 2015-06-16 |
| 9059333 | Facilitating chip dicing for metal-metal bonding and hybrid wafer bonding | Mukta G. Farooq, Erdem Kaltalioglu, Wei Lin, Spyridon Skordas | 2015-06-16 |
| 8900885 | Wafer bonding misalignment reduction | Alex Richard Hubbard, Douglas C. La Tulipe, Jr., Spyridon Skordas | 2014-12-02 |
| 8765578 | Edge protection of bonded wafers during wafer thinning | Douglas C. La Tulipe, Jr., Spyridon Skordas, Tuan A. Vo | 2014-07-01 |
| 8563403 | Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last | Mukta G. Farooq, Spyridon Skordas, Richard P. Volant | 2013-10-22 |
| 8546961 | Alignment marks to enable 3D integration | Mukta G. Farooq, Troy L. Graves-Abe, Robert Hannon, Emily R. Kinser, William Francis Landers +2 more | 2013-10-01 |