Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166260 | Embedded microstrip transmission line | Isaac Lauer, Srikanth Srinivasan, Neereja Sundaresan | 2024-12-10 |
| 11469485 | Embedded microstrip transmission line | Isaac Lauer, Srikanth Srinivasan, Neereja Sundaresan | 2022-10-11 |
| 11458474 | Microfluidic chips with one or more vias | Joshua T. Smith, Kevin R. Winstel, Teresa J. Wu | 2022-10-04 |
| 9490197 | Three dimensional organic or glass interposer | Mukta G. Farooq, Jin Ping Liu, Andrew J. Martin, Kathryn E. Schlichting, Melissa A. Smith | 2016-11-08 |
| 9059167 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, Ian D. Melville, Thomas M. Shaw, Huilong Zhu | 2015-06-16 |
| 8859390 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, Ian D. Melville, Thomas M. Shaw, Huilong Zhu | 2014-10-14 |
| 8691691 | TSV pillar as an interconnecting structure | Mukta G. Farooq, Troy L. Graves-Abe, Kevin S. Petrarca, Richard P. Volant | 2014-04-08 |
| 8546961 | Alignment marks to enable 3D integration | Mukta G. Farooq, Troy L. Graves-Abe, Robert Hannon, Emily R. Kinser, Kevin S. Petrarca +2 more | 2013-10-01 |
| 8386977 | Circuit design checking for three dimensional chip technology | Mukta G. Farooq, John A. Griesemer, Kevin S. Petrarca, Richard P. Volant | 2013-02-26 |
| 8367543 | Structure and method to improve current-carrying capabilities of C4 joints | Mukta G. Farooq, Jasvir Singh Jaspal, Thomas E. Lombardi, Hai P. Longworth, H. Bernhard Pogge +1 more | 2013-02-05 |
| 8288270 | Enhanced electromigration resistance in TSV structure and design | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, Timothy D. Sullivan | 2012-10-16 |
| 8237288 | Enhanced electromigration resistance in TSV structure and design | Mukta G. Farooq, John A. Griesemer, Gary LaFontant, Timothy D. Sullivan | 2012-08-07 |
| 7863183 | Method for fabricating last level copper-to-C4 connection with interfacial cap structure | Timothy H. Daubenspeck, Donna S. Zupanski-Nielsen | 2011-01-04 |
| 7714452 | Structure and method for producing multiple size interconnections | Lawrence A. Clevenger, Mukta G. Farooq, Louis L. Hsu, Donna S. Zupanski-Nielson, Carl Radens +1 more | 2010-05-11 |
| 7678673 | Strengthening of a structure by infiltration | Elbert E. Huang, Michael Lane, Eric G. Liniger, Xiao Hu Liu, David L. Questad +1 more | 2010-03-16 |
| 7544602 | Method and structure for ultra narrow crack stop for multilevel semiconductor device | Lawrence A. Clevenger, Matthew E. Colburn, Wai-Kin Li | 2009-06-09 |
| 7312529 | Structure and method for producing multiple size interconnections | Lawrence A. Clevenger, Mukta G. Farooq, Louis L. Hsu, Donna S. Zupanski-Nielsen, Carl Radens +1 more | 2007-12-25 |
| 7294565 | Method of fabricating a wire bond pad with Ni/Au metallization | Lloyd Burrell, Charles R. Davis, Ronald D. Goldblatt, Sanjay C. Mehta | 2007-11-13 |
| 7098676 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay, Sandra G. Malhotra +3 more | 2006-08-29 |
| 7009280 | Low-k interlevel dielectric layer (ILD) | Matthew S. Angyal, Edward Barth, Sanjit Das, Charles R. Davis, Habib Hichri +1 more | 2006-03-07 |
| 6815346 | Unique feature design enabling structural integrity for advanced low k semiconductor chips | Charles R. Davis, David L. Hawken, Dae Young Jung, David L. Questad | 2004-11-09 |
| 6650010 | Unique feature design enabling structural integrity for advanced low K semiconductor chips | Charles R. Davis, David L. Hawken, Dae Young Jung, David L. Questad | 2003-11-18 |
| 6413870 | Process of removing CMP scratches by BPSG reflow and integrated circuit chip formed thereby | Jeffrey P. Gambino | 2002-07-02 |
| 6325696 | Piezo-actuated CMP carrier | Karl E. Boggs, Kenneth M. Davis, Michael F. Lofaro, Adam D. Ticknor, Ronald D. Fiege | 2001-12-04 |
| 6296717 | Regeneration of chemical mechanical polishing pads in-situ | Adam D. Ticknor, Karl E. Boggs, Kenneth M. Davis, Michael L. Passow | 2001-10-02 |