Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218120 | Device mismatch mitigation for medium range and beyond distances | Dureseti Chidambarrao, Noah Zamdmer, Varadarajan Vidya, James D. Strom, Grant P. Kesselring +1 more | 2025-02-04 |
| 11663391 | Latch-up avoidance for sea-of-gates | David Wolpert, Ryan Michael Kruse, Leon Sigal, Richard Edward Serton, Terence B. Hook +1 more | 2023-05-30 |
| 11011415 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Naftali E. Lustig | 2021-05-18 |
| 10796949 | Airgap vias in electrical interconnects | Rasit Onur Topaloglu, Naftali E. Lustig | 2020-10-06 |
| 9859208 | Bottom self-aligned via | Naftali E. Lustig, Rasit Onur Topaloglu | 2018-01-02 |
| 9455186 | Selective local metal cap layer formation for improved electromigration behavior | Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-09-27 |
| 9406560 | Selective local metal cap layer formation for improved electromigration behavior | Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-08-02 |
| 9385038 | Selective local metal cap layer formation for improved electromigration behavior | Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2016-07-05 |
| 9076847 | Selective local metal cap layer formation for improved electromigration behavior | Junjing Bao, Griselda Bonilla, Samuel S. Choi, James A. Culp, Thomas W. Dyer +4 more | 2015-07-07 |
| 8927442 | SiCOH hardmask with graded transition layers | Yannick Loquet, Yann Mignot, Son V. Nguyen, Muthumanickam Sankarapandian, Hosadurga Shobha | 2015-01-06 |
| 8822342 | Method to reduce depth delta between dense and wide features in dual damascene structures | Ravi Prakash Srivastava, Oluwafemi. O. Ogunsola, Craig Child, Muhammed Shafi Pallachalil, Habib Hichri +1 more | 2014-09-02 |
| 8450212 | Method of reducing critical dimension process bias differences between narrow and wide damascene wires | Oluwafemi O. Ogunsola, Hakeem B. S. Akinmade-Yusuff | 2013-05-28 |
| 8350359 | Semiconductor device using an aluminum interconnect to form through-silicon vias | Kevin S. Petrarca, Lawrence A. Clevenger, Carl Radens, Brian C. Sapp | 2013-01-08 |
| 8237246 | Deep trench crackstops under contacts | Lawrence A. Clevenger, Vincent J. McGahay, Satyanarayana V. Nitta, Shaoning Yao | 2012-08-07 |
| 8188574 | Pedestal guard ring having continuous M1 metal barrier connected to crack stop | Mahender Kumar, Effendi Leobandung, Jay William Strane | 2012-05-29 |
| 7544609 | Method for integrating liner formation in back end of line processing | Habib Hichri, Christopher J. Penny, David Watts | 2009-06-09 |
| 7480605 | Techniques for determining parameter variability for interconnects in the presence of manufacturing uncertainty | Alina Deutsch, Ibrahim M. Elfadel, Zhichao Zhang | 2009-01-20 |
| 7475368 | Deflection analysis system and method for circuit design | Giovanni Fiorenza, Habib Hichri, Andrew Lu, Dale Curtis McHerron, Conal E. Murray | 2009-01-06 |
| 7325225 | Method and apparatus for reducing OPC model errors | Yasushi Tanaka, Masahiro Inohara | 2008-01-29 |
| 7214608 | Interlevel dielectric layer and metal layer sealing | Peter Biolsi, Lawrence A. Clevenger, Habib Hichri, Bernd Kastenmeier, Michael Lane +3 more | 2007-05-08 |
| 7135398 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Stephen M. Gates, Terry A. Spooner +3 more | 2006-11-14 |
| 7093206 | Computer aided design method and apparatus for modeling and analyzing on-chip interconnect structures | Minakshisundaran Balasubramanian Anand, Alina Deutsch, Ibrahim M. Elfadel, Gerard V. Kopcsay, Barry J. Rubin +1 more | 2006-08-15 |
| 7009280 | Low-k interlevel dielectric layer (ILD) | Edward Barth, Sanjit Das, Charles R. Davis, Habib Hichri, William Francis Landers +1 more | 2006-03-07 |
| 6967158 | Method for forming a low-k dielectric structure on a substrate | Yuri Solomentsev, Errol Todd Ryan, Susan Kim | 2005-11-22 |
| 6917108 | Reliable low-k interconnect structure with hybrid dielectric | John A. Fitzsimmons, Stephen E. Greco, Jia Lee, Stephen M. Gates, Terry A. Spooner +3 more | 2005-07-12 |