| 12101530 |
Methods and apparatus to identify user presence to a meter |
— |
2024-09-24 |
| 11895363 |
Methods and apparatus to identify user presence to a meter |
— |
2024-02-06 |
| 11363334 |
Methods and apparatus to identify user presence to a meter |
— |
2022-06-14 |
| 9219819 |
Load balancing and sharing of contextual information in a multi-vendor and/or multiple contact center environment |
Kevin Glass |
2015-12-22 |
| 8137158 |
Electrical contact method |
Rui Fang, Deepak Kulkarni |
2012-03-20 |
| 7883395 |
Electrical contact structures and methods for use |
Rui Fang, Deepak Kulkarni |
2011-02-08 |
| 7820051 |
Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes |
Rui Fang, Deepak Kulkarni |
2010-10-26 |
| 7807036 |
Method and system for pad conditioning in an ECMP process |
Rui Fang, Deepak Kulkarni |
2010-10-05 |
| 7544609 |
Method for integrating liner formation in back end of line processing |
Matthew S. Angyal, Habib Hichri, Christopher J. Penny |
2009-06-09 |
| 6379463 |
Web coating material supply apparatus and method |
John Kelley |
2002-04-30 |
| 6372111 |
Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process |
— |
2002-04-16 |
| 6362103 |
Method and apparatus for rejuvenating a CMP chemical solution |
— |
2002-03-26 |
| 6096652 |
Method of chemical mechanical planarization using copper coordinating ligands |
János Farkas, Jason Aquinde GOMEZ, Chelsea Dang |
2000-08-01 |
| 6071816 |
Method of chemical mechanical planarization using a water rinse to prevent particle contamination |
Rajeev Bajaj, Sanjit Das |
2000-06-06 |
| 6045435 |
Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects |
Rajeev Bajaj, Subramoney Iyer, Thom Kobayashi, Jaime Saravia, Mark G. Fernandes |
2000-04-04 |
| 6001730 |
Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers |
János Farkas, Rajeev Bajaj, Melissa Freeman, Sanjit Das |
1999-12-14 |
| 5985748 |
Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process |
Franklin D. Nkansah, John Mendonca |
1999-11-16 |
| 5935871 |
Process for forming a semiconductor device |
János Farkas, Melissa Freeman |
1999-08-10 |
| 5897375 |
Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture |
Rajeev Bajaj, Sanjit Das, János Farkas, Chelsea Dang, Melissa Freeman +3 more |
1999-04-27 |
