Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101530 | Methods and apparatus to identify user presence to a meter | — | 2024-09-24 |
| 11895363 | Methods and apparatus to identify user presence to a meter | — | 2024-02-06 |
| 11363334 | Methods and apparatus to identify user presence to a meter | — | 2022-06-14 |
| 9219819 | Load balancing and sharing of contextual information in a multi-vendor and/or multiple contact center environment | Kevin Glass | 2015-12-22 |
| 8137158 | Electrical contact method | Rui Fang, Deepak Kulkarni | 2012-03-20 |
| 7883395 | Electrical contact structures and methods for use | Rui Fang, Deepak Kulkarni | 2011-02-08 |
| 7820051 | Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes | Rui Fang, Deepak Kulkarni | 2010-10-26 |
| 7807036 | Method and system for pad conditioning in an ECMP process | Rui Fang, Deepak Kulkarni | 2010-10-05 |
| 7544609 | Method for integrating liner formation in back end of line processing | Matthew S. Angyal, Habib Hichri, Christopher J. Penny | 2009-06-09 |
| 6379463 | Web coating material supply apparatus and method | John Kelley | 2002-04-30 |
| 6372111 | Method and apparatus for reclaiming a metal from a CMP process for use in an electroplating process | — | 2002-04-16 |
| 6362103 | Method and apparatus for rejuvenating a CMP chemical solution | — | 2002-03-26 |
| 6096652 | Method of chemical mechanical planarization using copper coordinating ligands | János Farkas, Jason Aquinde GOMEZ, Chelsea Dang | 2000-08-01 |
| 6071816 | Method of chemical mechanical planarization using a water rinse to prevent particle contamination | Rajeev Bajaj, Sanjit Das | 2000-06-06 |
| 6045435 | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects | Rajeev Bajaj, Subramoney Iyer, Thom Kobayashi, Jaime Saravia, Mark G. Fernandes | 2000-04-04 |
| 6001730 | Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers | János Farkas, Rajeev Bajaj, Melissa Freeman, Sanjit Das | 1999-12-14 |
| 5985748 | Method of making a semiconductor device using chemical-mechanical polishing having a combination-step process | Franklin D. Nkansah, John Mendonca | 1999-11-16 |
| 5935871 | Process for forming a semiconductor device | János Farkas, Melissa Freeman | 1999-08-10 |
| 5897375 | Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture | Rajeev Bajaj, Sanjit Das, János Farkas, Chelsea Dang, Melissa Freeman +3 more | 1999-04-27 |