Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6045435 | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects | Rajeev Bajaj, Subramoney Iyer, Jaime Saravia, Mark G. Fernandes, David Watts | 2000-04-04 |