| 7034400 |
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors |
Glenn A. Biery, Jeffrey P. Gambino, Thomas Ivers, Hyun Koo Lee, Ernest N. Levine +2 more |
2006-04-25 |
| 7009280 |
Low-k interlevel dielectric layer (ILD) |
Matthew S. Angyal, Sanjit Das, Charles R. Davis, Habib Hichri, William Francis Landers +1 more |
2006-03-07 |
| 6939797 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more |
2005-09-06 |
| 6849563 |
Method and apparatus for controlling coating thickness |
John A. Fitzsimmons, Arthur Winston Martin, Lee M. Nicholson |
2005-02-01 |
| 6737747 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more |
2004-05-18 |
| 6726996 |
Laminated diffusion barrier |
Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers +3 more |
2004-04-27 |
