Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7034400 | Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors | Glenn A. Biery, Jeffrey P. Gambino, Thomas Ivers, Hyun Koo Lee, Ernest N. Levine +2 more | 2006-04-25 |
| 7009280 | Low-k interlevel dielectric layer (ILD) | Matthew S. Angyal, Sanjit Das, Charles R. Davis, Habib Hichri, William Francis Landers +1 more | 2006-03-07 |
| 6939797 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more | 2005-09-06 |
| 6849563 | Method and apparatus for controlling coating thickness | John A. Fitzsimmons, Arthur Winston Martin, Lee M. Nicholson | 2005-02-01 |
| 6737747 | Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof | John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers, Sarah L. Lane, Jia Lee +3 more | 2004-05-18 |
| 6726996 | Laminated diffusion barrier | Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers +3 more | 2004-04-27 |