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Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors |
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Stacked via-stud with improved reliability in copper metallurgy |
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Micro-surface fabrication process |
Christopher P. Ausschnitt, Nancy Anne Greco |
2002-01-01 |
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Adhesion of silicon carbide films |
Donna R. Cote, Daniel C. Edelstein, John A. Fitzsimmons, Thomas Ivers, Paul C. Jamison |
2001-06-26 |
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Manufacturing methods and uses for micro pipe systems |
Michael F. Lofaro, James G. Ryan |
2001-05-08 |
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Manipulation of micromechanical objects |
Nancy Anne Greco, Michael F. Lofaro, James G. Ryan |
2001-03-13 |
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Low temperature via fill using liquid phase transport |
Jeffrey P. Gambino, Peter D. Hoh, Mark A. Jaso |
2001-01-23 |
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Method for producing a crack stop for interlevel dielectric layers |
Robert Cook, Eduardo Garcia, Nancy Anne Greco, Stephen E. Greco |
2001-01-16 |
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Casting of complex micromechanical objects |
Nancy Anne Greco, Michael F. Lofaro, James G. Ryan |
2000-08-08 |
| 6091131 |
Integrated circuit having crack stop for interlevel dielectric layers |
Robert Cook, Eduardo Garcia, Nancy Anne Greco, Stephen E. Greco |
2000-07-18 |
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Metal deposition process for metal lines over topography |
Parth Dave, Nancy Anne Greco, Darryl D. Restaino |
2000-07-04 |
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Semiconductor structures containing a micro pipe system therein |
Michael F. Lofaro, James G. Ryan |
2000-02-29 |
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Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing |
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Energy relieving crack stop |
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1998-11-10 |
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Automated non-visual method of locating periodically arranged sub-micron objects |
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1998-05-05 |
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Process for forming improved solder connections for semiconductor devices with enhanced fatigue life |
Lewis D. Lipschutz, Horatio Quinones |
1986-09-16 |
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Method and wire for submerged arc welding of pipe |
Stephen F. Baumann, Masahiro Nakabayashi, Gerald Daniel Uttrachi, Thomas L. Coless |
1981-03-17 |