EL

Ernest N. Levine

IBM: 16 patents #6,952 of 70,183Top 10%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
SC Siemens Components: 1 patents #6 of 30Top 20%
UC Union Carbide: 1 patents #697 of 1,402Top 50%
Overall (All Time): #279,491 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7034400 Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors Edward Barth, Glenn A. Biery, Jeffrey P. Gambino, Thomas Ivers, Hyun Koo Lee +2 more 2006-04-25
6972209 Stacked via-stud with improved reliability in copper metallurgy Birendra Agarwala, Conrad A. Barile, Hormazdyar M. Dalal, Brett H. Engle, Michael Lane +8 more 2005-12-06
6335151 Micro-surface fabrication process Christopher P. Ausschnitt, Nancy Anne Greco 2002-01-01
6252295 Adhesion of silicon carbide films Donna R. Cote, Daniel C. Edelstein, John A. Fitzsimmons, Thomas Ivers, Paul C. Jamison 2001-06-26
6228744 Manufacturing methods and uses for micro pipe systems Michael F. Lofaro, James G. Ryan 2001-05-08
6199269 Manipulation of micromechanical objects Nancy Anne Greco, Michael F. Lofaro, James G. Ryan 2001-03-13
6177348 Low temperature via fill using liquid phase transport Jeffrey P. Gambino, Peter D. Hoh, Mark A. Jaso 2001-01-23
6174814 Method for producing a crack stop for interlevel dielectric layers Robert Cook, Eduardo Garcia, Nancy Anne Greco, Stephen E. Greco 2001-01-16
6098788 Casting of complex micromechanical objects Nancy Anne Greco, Michael F. Lofaro, James G. Ryan 2000-08-08
6091131 Integrated circuit having crack stop for interlevel dielectric layers Robert Cook, Eduardo Garcia, Nancy Anne Greco, Stephen E. Greco 2000-07-18
6083823 Metal deposition process for metal lines over topography Parth Dave, Nancy Anne Greco, Darryl D. Restaino 2000-07-04
6031286 Semiconductor structures containing a micro pipe system therein Michael F. Lofaro, James G. Ryan 2000-02-29
5846884 Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing Munir D. Naeem, Stuart M. Burns, Nancy Anne Greco, STEVE GRECO, Virinder Grewal +2 more 1998-12-08
5834829 Energy relieving crack stop Bettina Dinkel, Pei-Ing Lee 1998-11-10
5747802 Automated non-visual method of locating periodically arranged sub-micron objects Norbert Arnold, Klaus Hummler, Rainer Weiland 1998-05-05
4611746 Process for forming improved solder connections for semiconductor devices with enhanced fatigue life Lewis D. Lipschutz, Horatio Quinones 1986-09-16
4256949 Method and wire for submerged arc welding of pipe Stephen F. Baumann, Masahiro Nakabayashi, Gerald Daniel Uttrachi, Thomas L. Coless 1981-03-17