Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8192638 | Method for manufacturing multiple layers of waveguides | Andrew T. S. Pomerene, Timothy J. Conway, Craig M. Hill | 2012-06-05 |
| 7974505 | Method for fabricating selectively coupled optical waveguides on a substrate | Craig M. Hill | 2011-07-05 |
| 6974524 | Apparatus, method and system for monitoring chamber parameters associated with a deposition process | Terry L. Gilton | 2005-12-13 |
| 6811657 | Device for measuring the profile of a metal film sputter deposition target, and system and method employing same | — | 2004-11-02 |
| 6632377 | Chemical-mechanical planarization of metallurgy | Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, William L. Guthrie, Frank B. Kaufman +4 more | 2003-10-14 |
| 6344409 | Dummy patterns for aluminum chemical polishing (CMP) | Rainer Florian Schnabel | 2002-02-05 |
| 6186864 | Method and apparatus for monitoring polishing pad wear during processing | Thomas R. Fisher, Jr., Leonard C. Stevens, Jr. | 2001-02-13 |
| 6177348 | Low temperature via fill using liquid phase transport | Jeffrey P. Gambino, Peter D. Hoh, Ernest N. Levine | 2001-01-23 |
| 6166423 | Integrated circuit having a via and a capacitor | Jeffrey P. Gambino, David E. Kotecki | 2000-12-26 |
| 6153474 | Method of controllably forming a LOCOS oxide layer over a portion of a vertically extending sidewall of a trench extending into a semiconductor substrate | Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, David M. Dobuzinsky +1 more | 2000-11-28 |
| 6136686 | Fabrication of interconnects with two different thicknesses | Jeffrey P. Gambino, Hing Wong | 2000-10-24 |
| 6114248 | Process to reduce localized polish stop erosion | Jeffrey P. Gambino | 2000-09-05 |
| 6107125 | SOI/bulk hybrid substrate and method of forming the same | Jack A. Mandelman, William R. Tonti, Matthew R. Wordeman | 2000-08-22 |
| 6093631 | Dummy patterns for aluminum chemical polishing (CMP) | Rainer Florian Schnabel | 2000-07-25 |
| 6045434 | Method and apparatus of monitoring polishing pad wear during processing | Thomas R. Fisher, Jr., Leonard C. Stevens, Jr. | 2000-04-04 |
| 6025226 | Method of forming a capacitor and a capacitor formed using the method | Jeffrey P. Gambino, David E. Kotecki | 2000-02-15 |
| 5894152 | SOI/bulk hybrid substrate and method of forming the same | Jack A. Mandelman, William R. Tonti, Matthew R. Wordeman | 1999-04-13 |
| 5885899 | Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry | Michael D. Armacost, David M. Dobuzinsky, Jeffery P. GAMBINO | 1999-03-23 |
| 5854140 | Method of making an aluminum contact | Herbert Palm, Hans W. Poetzlberger | 1998-12-29 |
| 5795826 | Method of chemically mechanically polishing an electronic component | Jeffrey P. Gambino, Larry A. Nesbit | 1998-08-18 |
| 5726099 | Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry | — | 1998-03-10 |
| 5656535 | Storage node process for deep trench-based DRAM | Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, David M. Dobuzinsky +1 more | 1997-08-12 |
| 5573633 | Method of chemically mechanically polishing an electronic component | Jeffrey P. Gambino, Larry A. Nesbit | 1996-11-12 |
| 5264387 | Method of forming uniformly thin, isolated silicon mesas on an insulating substrate | Klaus D. Beyer, Subramanian S. Iyer, Scott R. Stiffler, James D. Warnock | 1993-11-23 |
| 5246884 | CVD diamond or diamond-like carbon for chemical-mechanical polish etch stop | Paul Bahnsen Jones, Bernard S. Meyerson, Vishnubhai V. Patel | 1993-09-21 |