| 8192638 |
Method for manufacturing multiple layers of waveguides |
Andrew T. S. Pomerene, Timothy J. Conway, Craig M. Hill |
2012-06-05 |
|
| 7974505 |
Method for fabricating selectively coupled optical waveguides on a substrate |
Craig M. Hill |
2011-07-05 |
|
| 6974524 |
Apparatus, method and system for monitoring chamber parameters associated with a deposition process |
Terry L. Gilton |
2005-12-13 |
$1,839,000 |
| 6811657 |
Device for measuring the profile of a metal film sputter deposition target, and system and method employing same |
— |
2004-11-02 |
$1,227,000 |
| 6632377 |
Chemical-mechanical planarization of metallurgy |
Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, William L. Guthrie, Frank B. Kaufman +4 more |
2003-10-14 |
$12,688,000 |
| 6344409 |
Dummy patterns for aluminum chemical polishing (CMP) |
Rainer Florian Schnabel |
2002-02-05 |
$11,026,000 |
| 6186864 |
Method and apparatus for monitoring polishing pad wear during processing |
Thomas R. Fisher, Jr., Leonard C. Stevens, Jr. |
2001-02-13 |
$30,258,000 |
| 6177348 |
Low temperature via fill using liquid phase transport |
Jeffrey P. Gambino, Peter D. Hoh, Ernest N. Levine |
2001-01-23 |
$22,404,000 |
| 6166423 |
Integrated circuit having a via and a capacitor |
Jeffrey P. Gambino, David E. Kotecki |
2000-12-26 |
$36,095,000 |
| 6153474 |
Method of controllably forming a LOCOS oxide layer over a portion of a vertically extending sidewall of a trench extending into a semiconductor substrate |
Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, David M. Dobuzinsky +1 more |
2000-11-28 |
$55,341,000 |
| 6136686 |
Fabrication of interconnects with two different thicknesses |
Jeffrey P. Gambino, Hing Wong |
2000-10-24 |
$26,546,000 |
| 6114248 |
Process to reduce localized polish stop erosion |
Jeffrey P. Gambino |
2000-09-05 |
$37,092,000 |
| 6107125 |
SOI/bulk hybrid substrate and method of forming the same |
Jack A. Mandelman, William R. Tonti, Matthew R. Wordeman |
2000-08-22 |
$30,771,000 |
| 6093631 |
Dummy patterns for aluminum chemical polishing (CMP) |
Rainer Florian Schnabel |
2000-07-25 |
$46,831,000 |
| 6045434 |
Method and apparatus of monitoring polishing pad wear during processing |
Thomas R. Fisher, Jr., Leonard C. Stevens, Jr. |
2000-04-04 |
$49,141,000 |
| 6025226 |
Method of forming a capacitor and a capacitor formed using the method |
Jeffrey P. Gambino, David E. Kotecki |
2000-02-15 |
$27,373,000 |
| 5894152 |
SOI/bulk hybrid substrate and method of forming the same |
Jack A. Mandelman, William R. Tonti, Matthew R. Wordeman |
1999-04-13 |
$29,035,000 |
| 5885899 |
Method of chemically mechanically polishing an electronic component using a non-selective ammonium hydroxide slurry |
Michael D. Armacost, David M. Dobuzinsky, Jeffery P. GAMBINO |
1999-03-23 |
$36,980,000 |
| 5854140 |
Method of making an aluminum contact |
Herbert Palm, Hans W. Poetzlberger |
1998-12-29 |
$61,066,000 |
| 5795826 |
Method of chemically mechanically polishing an electronic component |
Jeffrey P. Gambino, Larry A. Nesbit |
1998-08-18 |
$11,146,000 |
| 5726099 |
Method of chemically mechanically polishing an electronic component using a non-selective ammonium persulfate slurry |
— |
1998-03-10 |
$20,586,000 |
| 5656535 |
Storage node process for deep trench-based DRAM |
Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, Erwin Hammerl, David M. Dobuzinsky +1 more |
1997-08-12 |
$28,856,000 |
| 5573633 |
Method of chemically mechanically polishing an electronic component |
Jeffrey P. Gambino, Larry A. Nesbit |
1996-11-12 |
$16,914,000 |
| 5264387 |
Method of forming uniformly thin, isolated silicon mesas on an insulating substrate |
Klaus D. Beyer, Subramanian S. Iyer, Scott R. Stiffler, James D. Warnock |
1993-11-23 |
$5,940,000 |
| 5246884 |
CVD diamond or diamond-like carbon for chemical-mechanical polish etch stop |
Paul Bahnsen Jones, Bernard S. Meyerson, Vishnubhai V. Patel |
1993-09-21 |
$6,888,000 |
