EH

Erwin Hammerl

SA Siemens Aktiengesellschaft: 15 patents #543 of 22,248Top 3%
IBM: 15 patents #7,450 of 70,183Top 15%
KT Kabushiki Kaisha Toshiba: 3 patents #8,011 of 21,451Top 40%
Infineon Technologies Ag: 2 patents #4,439 of 7,486Top 60%
Overall (All Time): #226,154 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6560731 Method for checking the functioning of memory cells of an integrated semiconductor memory Wilfried Daehn 2003-05-06
6153474 Method of controllably forming a LOCOS oxide layer over a portion of a vertically extending sidewall of a trench extending into a semiconductor substrate Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, David M. Dobuzinsky, Jack A. Mandelman +1 more 2000-11-28
6140208 Shallow trench isolation (STI) with bilayer of oxide-nitride for VLSI applications Farid Agahi, Gary B. Bronner, Bertrand Flietner, Herbert L. Ho, Radhika Srinivasan 2000-10-31
6046487 Shallow trench isolation with oxide-nitride/oxynitride liner John Benedict, David M. Dobuzinsky, Philip L. Flaitz, Herbert L. Ho, James F. Moseman +3 more 2000-04-04
5937292 Nitride cap formation in a DRAM trench capacitor Herb Lei Ho 1999-08-10
5899724 Method for fabricating a titanium resistor David M. Dobuzinsky, Stephen G. Fugardi, Herbert L. Ho, Samuel C. Ramac, Alvin W. Strong 1999-05-04
5893735 Three-dimensional device layout with sub-groundrule features Reinhard Stengl, Jack A. Mandelman, Herbert L. Ho, Radhika Srinivasan, Alvin P. Short +1 more 1999-04-13
5844266 Buried strap formation in a DRAM trench capacitor Reinhard Stengl, Herbert L. Ho, Jack A. Mandelman, Radhika Srinivasan, Alvin P. Short 1998-12-01
5828076 Microelectronic component and process for its production Harald Gossner, Ignaz Eisele, Lothar Risch 1998-10-27
5827765 Buried-strap formation in a dram trench capacitor Reinhard Stengl, Herbert L. Ho, Jack A. Mandelman, Radhika Srinivasan, Alvin P. Short 1998-10-27
5792685 Three-dimensional device layout having a trench capacitor Jack A. Mandelman, Bernhard Poschenrieder, Alvin P. Short, Radhika Srinivasan, Reinhard Stengl +1 more 1998-08-11
5763315 Shallow trench isolation with oxide-nitride/oxynitride liner John Benedict, David M. Dobuzinsky, Philip L. Flaitz, Herbert L. Ho, James F. Moseman +3 more 1998-06-09
5747866 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, David M. Dobuzinsky, Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1998-05-05
5717628 Nitride cap formation in a DRAM trench capacitor Herb Lei Ho 1998-02-10
5674769 Process for forming deep trench DRAMs with sub-groundrule gates Johann Alsmeier, Christine Dehm, Reinhard Stengl 1997-10-07
5670805 Controlled recrystallization of buried strap in a semiconductor memory device Jack A. Mandelman, Herbert L. Ho, Junichi Shiozawa, Reinhard Stengl 1997-09-23
5656535 Storage node process for deep trench-based DRAM Herbert L. Ho, Radhika Srinivasan, Scott D. Halle, David M. Dobuzinsky, Jack A. Mandelman +1 more 1997-08-12
5643823 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, David M. Dobuzinsky, J. Herbert Palm, Stephen G. Fugardi, Atul Ajmera +2 more 1997-07-01
5543348 Controlled recrystallization of buried strap in a semiconductor memory device Jack A. Mandelman, Herbert L. Ho, Junichi Shiozawa, Reinhard Stengl 1996-08-06
5447884 Shallow trench isolation with thin nitride liner Paul Fahey, Herbert L. Ho, Mutsuo Morikado 1995-09-05