SR

Samuel C. Ramac

IBM: 7 patents #14,640 of 70,183Top 25%
SA Siemens Aktiengesellschaft: 3 patents #4,667 of 22,248Top 25%
Overall (All Time): #656,975 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7714366 CMOS transistor with a polysilicon gate electrode having varying grain size Arne Ballantine, Kevin K. Chan, Jeffrey D. Gilbert, Kevin M. Houlihan, Glen L. Miles +3 more 2010-05-11
6893948 Method of reducing polysilicon depletion in a polysilicon gate electrode by depositing polysilicon of varying grain size Arne Ballantine, Kevin K. Chan, Jeffrey D. Gilbert, Kevin M. Houlihan, Glen L. Miles +3 more 2005-05-17
6787427 Method to fabricate SiGe HBTs with controlled current gain and improved breakdown voltage characteristics David R. Greenberg, Basanth Jagannathan, Shwu-Jen Jeng, Joseph T. Kocis, David M. Rockwell 2004-09-07
6670263 Method of reducing polysilicon depletion in a polysilicon gate electrode by depositing polysilicon of varying grain size Arne Ballantine, Kevin K. Chan, Jeffrey D. Gilbert, Kevin M. Houlihan, Glen L. Miles +3 more 2003-12-30
6656809 Method to fabricate SiGe HBTs with controlled current gain and improved breakdown voltage characteristics David R. Greenberg, Basanth Jagannathan, Shwu-Jen Jeng, Joseph T. Kocis, David M. Rockwell 2003-12-02
5899724 Method for fabricating a titanium resistor David M. Dobuzinsky, Stephen G. Fugardi, Erwin Hammerl, Herbert L. Ho, Alvin W. Strong 1999-05-04
5747866 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, Erwin Hammerl, David M. Dobuzinsky, Herbert Palm, Stephen G. Fugardi +2 more 1998-05-05
5643823 Application of thin crystalline Si.sub.3 N.sub.4 liners in shallow trench isolation (STI) structures Herbert L. Ho, Erwin Hammerl, David M. Dobuzinsky, J. Herbert Palm, Stephen G. Fugardi +2 more 1997-07-01