Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6294026 | Distribution plate for a reaction chamber with multiple gas inlets and separate mass flow control loops | Klaus Roithner, Karl Paul Muller | 2001-09-25 |
| 5893735 | Three-dimensional device layout with sub-groundrule features | Reinhard Stengl, Erwin Hammerl, Jack A. Mandelman, Herbert L. Ho, Radhika Srinivasan +1 more | 1999-04-13 |
| 5815247 | Avoidance of pattern shortening by using off axis illumination with dipole and polarizing apertures | Takashi Sato, Tsukasa Azuma | 1998-09-29 |
| 5792685 | Three-dimensional device layout having a trench capacitor | Erwin Hammerl, Jack A. Mandelman, Alvin P. Short, Radhika Srinivasan, Reinhard Stengl +1 more | 1998-08-11 |
| 5776808 | Pad stack with a poly SI etch stop for TEOS mask removal with RIE | Karl Paul Muller, Klaus Roithner | 1998-07-07 |
| 5723381 | Formation of self-aligned overlapping bitline contacts with sacrificial polysilicon fill-in stud | Virinder Grewal | 1998-03-03 |
| 5712698 | Independently controllable shutters and variable area apertures for off axis illumination | Takashi Sato, Tsukasa Azuma | 1998-01-27 |
| 5605600 | Etch profile shaping through wafer temperature control | Karl Paul Muller, Klaus Roithner, Toru Watanabe | 1997-02-25 |