VG

Virinder Grewal

SA Siemens Aktiengesellschaft: 15 patents #543 of 22,248Top 3%
IBM: 5 patents #18,733 of 70,183Top 30%
KT Kabushiki Kaisha Toshiba: 3 patents #8,011 of 21,451Top 40%
Applied Materials: 2 patents #3,641 of 7,310Top 50%
SC Siemens Components: 1 patents #6 of 30Top 20%
📍 Ebersberg, NY: #1 of 1 inventorsTop 100%
Overall (All Time): #258,956 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
7658969 Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same Ajay Kumar, Wai-Fan Yau 2010-02-09
6897155 Method for etching high-aspect-ratio features Ajay Kumar, Anisul Khan, Dragan Podlesnik, Sharma Pamarthy, Axel Henke +1 more 2005-05-24
6300235 Method of forming multi-level coplanar metal/insulator films using dual damascene with sacrificial flowable oxide Klaus Feldner, Bernd Vollmer, Rainer Florian Schnabel 2001-10-09
6071820 Method for patterning integrated circuit conductors Bruno Spuler 2000-06-06
6008121 Etching high aspect contact holes in solid state devices Chi-Hua Yang, Volker B. Laux 1999-12-28
5976986 Low pressure and low power C1.sub.2 /HC1 process for sub-micron metal etching Munir D. Naeem, Stuart M. Burns, Rosemary Christie, Walter W. Kocon, Masaki Narita +2 more 1999-11-02
5926689 Process for reducing circuit damage during PECVD in single wafer PECVD system Donna R. Cote, John C. Forster, Anthony Konecni, Dragan Podlesnik 1999-07-20
5874363 Polycide etching with HCL and chlorine Peter D. Hoh, Tokuhisa Ohiwa, Bruno Spuler, Waldemar Walter Kocon, Guadalupe Wiltshire 1999-02-23
5846884 Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing Munir D. Naeem, Stuart M. Burns, Nancy Anne Greco, STEVE GRECO, Ernest N. Levine +2 more 1998-12-08
5723381 Formation of self-aligned overlapping bitline contacts with sacrificial polysilicon fill-in stud Bernhard Poschenrieder 1998-03-03
5597438 Etch chamber having three independently controlled electrodes Volker B. Laux 1997-01-28
5591301 Plasma etching method 1997-01-07
5529197 Polysilicon/polycide etch process for sub-micron gate stacks 1996-06-25
5262002 Method for manufacturing a trench structure in a substrate Siegfried Schwarzl 1993-11-16
5212114 Process for global planarizing of surfaces for integrated semiconductor circuits Klaus-Dieter Menz, Ronald Huber 1993-05-18
4764245 Method for generating contact holes with beveled sidewalls in intermediate oxide layers 1988-08-16
4482209 Mirror structure Werner Reindl 1984-11-13
4372809 Method for manufacturing solderable, temperable, thin film tracks which do not contain precious metal Werner Reindl 1983-02-08