Issued Patents All Time
Showing 1–25 of 60 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257302 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Nerissa Draeger, Vishal Gauri +4 more | 2016-02-09 |
| 8293430 | Method for etching a molybdenum layer suitable for photomask fabrication | Madhavi R. Chandrachood, Ajay Kumar | 2012-10-23 |
| 8187951 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Nerissa Draeger | 2012-05-29 |
| 7888273 | Density gradient-free gap fill | Feng Wang, Victor Lu, Brian Lu | 2011-02-15 |
| 7790334 | Method for photomask plasma etching using a protected mask | Madhavi R. Chandrachood, Ajay Kumar | 2010-09-07 |
| 7678709 | Method of forming low-temperature conformal dielectric films | Brian Lu, Collin Kwok Leung Mui, Bunsen B. Nie, Raihan M. Tarafdar | 2010-03-16 |
| 7658969 | Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same | Ajay Kumar, Virinder Grewal | 2010-02-09 |
| 7651725 | Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2010-01-26 |
| 7629227 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Nerissa Draeger | 2009-12-08 |
| 7560377 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2009-07-14 |
| 7482247 | Conformal nanolaminate dielectric deposition and etch bag gap fill process | George D. Papasouliotis, Raihan M. Tarafdar, Ron Rulkins, Dennis M. Hausmann, Jeff Tobin +5 more | 2009-01-27 |
| 7320942 | Method for removal of metallic residue after plasma etching of a metal layer | Xiaoyi Chen, Chentsau Ying, Padmapani Nallan, Ajay Kumar, Ralph Kerns +3 more | 2008-01-22 |
| 7227244 | Integrated low k dielectrics and etch stops | Claes Bjorkman, Melissa Yu, Hongquing Shan, David Cheung, Kuowei Liu +7 more | 2007-06-05 |
| 7205249 | CVD plasma assisted low dielectric constant films | David Cheung, Robert R. Mandal | 2007-04-17 |
| 7160821 | Method of depositing low k films | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, David Cheung +5 more | 2007-01-09 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Shin-Puu Jeng +2 more | 2006-07-11 |
| 7070657 | Method and apparatus for depositing antireflective coating | David Cheung, Joe Feng, Judy H. Huang | 2006-07-04 |
| 7023092 | Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds | David Cheung, Shin-Puu Jeng, Kuowei Liu, Yung-Cheng Yu | 2006-04-04 |
| 6930061 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2005-08-16 |
| 6869896 | Plasma processes for depositing low dielectric constant films | David Cheung, Robert P. Mandal, Shin-Puu Jeng, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2005-03-22 |
| 6858153 | Integrated low K dielectrics and etch stops | Claes Bjorkman, Min Melissa Yu, Hongquing Shan, David Cheung, Kuowei Liu +7 more | 2005-02-22 |
| 6806207 | Method of depositing low K films | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Ellie Yieh, David Cheung +5 more | 2004-10-19 |
| 6800571 | CVD plasma assisted low dielectric constant films | David Cheung, Robert R. Mandal | 2004-10-05 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Shin-Puu Jeng +2 more | 2004-08-31 |
| 6784107 | Method for planarizing a copper interconnect structure | Hui Chen, Chun YAN | 2004-08-31 |