| 9257302 |
CVD flowable gap fill |
Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger, Vishal Gauri +4 more |
2016-02-09 |
| 8951348 |
Single-chamber sequential curing of semiconductor wafers |
Krishnan Shrinivasan, George D. Kamian, Steve Gentile, Mark Yam |
2015-02-10 |
| 8889233 |
Method for reducing stress in porous dielectric films |
Maxim Kelman, Krishnan Shrinivasan, Victor Lu, Sean Chang, Guangquan Lu |
2014-11-18 |
| 8187951 |
CVD flowable gap fill |
Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger |
2012-05-29 |
| 8137465 |
Single-chamber sequential curing of semiconductor wafers |
Krishna Shrinivasan, George D. Kamian, Steve Gentile, Mark Yam |
2012-03-20 |
| 7888273 |
Density gradient-free gap fill |
Victor Lu, Brian Lu, Wai-Fan Yau |
2011-02-15 |
| 7629227 |
CVD flowable gap fill |
Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger |
2009-12-08 |
| 7381662 |
Methods for improving the cracking resistance of low-k dielectric materials |
Dong Niu, Haiying Fu, Brian Lu |
2008-06-03 |
| 7208389 |
Method of porogen removal from porous low-k films using UV radiation |
Adrianne K. Tipton, Brian Lu, Patrick A. Van Cleemput, Michelle T. Schulberg, Qingguo Wu +1 more |
2007-04-24 |
| 7176144 |
Plasma detemplating and silanol capping of porous dielectric films |
Michelle T. Schulberg, Jianing Sun, Raashina Humayun, Patrick A. Van Cleemput |
2007-02-13 |
| 7094713 |
Methods for improving the cracking resistance of low-k dielectric materials |
Dong Niu, Haiying Fu, Brian Lu |
2006-08-22 |