Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11224452 | Medical assistive device for quick positioning of reduction forceps | Hsien-Tsung Lu, Michael Lu, Rina Lu | 2022-01-18 |
| 10497591 | Load lock chamber and the cluster tool system using the same | Ren Zhou, Xuyen Pham, Sean Chang, Shicai Fang, Jie Lian +1 more | 2019-12-03 |
| 9822451 | Device and method for manufacturing nanostructures consisting of carbon | Ian Blackburn, Kenneth B. K. Teo, Nalin Rupesinghe | 2017-11-21 |
| 9564329 | Method and apparatus for fabricating dielectric structures | Kay Song, Minghang LI | 2017-02-07 |
| 9257302 | CVD flowable gap fill | Feng Wang, Victor Lu, Wai-Fan Yau, Nerissa Draeger, Vishal Gauri +4 more | 2016-02-09 |
| 9159608 | Method for forming TiSiN thin film layer by using atomic layer deposition | Woong Park, Young Jin Jang, Gi Youl Kim, Greg Siu, Hugo Silva +1 more | 2015-10-13 |
| 8215262 | Cluster tool architecture for processing a substrate | Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, II +10 more | 2012-07-10 |
| 8187951 | CVD flowable gap fill | Feng Wang, Victor Lu, Wai-Fan Yau, Nerissa Draeger | 2012-05-29 |
| 8181596 | Cluster tool architecture for processing a substrate | Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, II +10 more | 2012-05-22 |
| 8146530 | Cluster tool architecture for processing a substrate | Tetsuya Ishikawa, Rick J. Roberts, Helen R. Armer, Leon Volfovski, Jay D. Pinson, II +10 more | 2012-04-03 |
| 7888273 | Density gradient-free gap fill | Feng Wang, Victor Lu, Wai-Fan Yau | 2011-02-15 |
| 7678709 | Method of forming low-temperature conformal dielectric films | Wai-Fan Yau, Collin Kwok Leung Mui, Bunsen B. Nie, Raihan M. Tarafdar | 2010-03-16 |
| 7629227 | CVD flowable gap fill | Feng Wang, Victor Lu, Wai-Fan Yau, Nerissa Draeger | 2009-12-08 |
| 7482247 | Conformal nanolaminate dielectric deposition and etch bag gap fill process | George D. Papasouliotis, Raihan M. Tarafdar, Ron Rulkins, Dennis M. Hausmann, Jeff Tobin +5 more | 2009-01-27 |
| 7381662 | Methods for improving the cracking resistance of low-k dielectric materials | Dong Niu, Haiying Fu, Feng Wang | 2008-06-03 |
| 7265061 | Method and apparatus for UV exposure of low dielectric constant materials for porogen removal and improved mechanical properties | Seon-Mee Cho, Easwar Srinivasan, David Mordo | 2007-09-04 |
| 7208389 | Method of porogen removal from porous low-k films using UV radiation | Adrianne K. Tipton, Patrick A. Van Cleemput, Michelle T. Schulberg, Qingguo Wu, Haiying Fu +1 more | 2007-04-24 |
| 7094713 | Methods for improving the cracking resistance of low-k dielectric materials | Dong Niu, Haiying Fu, Feng Wang | 2006-08-22 |