Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806183 | Stress control on thin silicon substrates | Jie Su | 2017-10-31 |
| 9748113 | Method and apparatus for controlled dopant incorporation and activation in a chemical vapor deposition system | Eric A. Armour, Daewon Kwon | 2017-08-29 |
| 9240350 | Techniques for forming 3D structures | Ludovic Godet, Christopher R. Hatem | 2016-01-19 |
| 9123509 | Techniques for plasma processing a substrate | Kamal Hadidi, Helen L. Maynard, Ludovic Godet, Vikram Singh, Timothy J. Miller +1 more | 2015-09-01 |
| 8858816 | Enhanced etch and deposition profile control using plasma sheath engineering | Ludovic Godet, Timothy J. Miller, Vikram Singh | 2014-10-14 |
| 8728587 | Closed loop process control of plasma processed materials | Deven M. Raj, Harold Persing | 2014-05-20 |
| 8698106 | Apparatus for detecting film delamination and a method thereof | Helen L. Maynard | 2014-04-15 |
| 8679960 | Technique for processing a substrate having a non-planar surface | Vikram Singh, Heyun Yin, Helen L. Maynard, Ludovic Godet | 2014-03-25 |
| 8664561 | System and method for selectively controlling ion composition of ion sources | Kamal Hadidi, Rajesh Dorai, Bernard G. Lindsay, Vikram Singh | 2014-03-04 |
| 8603591 | Enhanced etch and deposition profile control using plasma sheath engineering | Ludovic Godet, Timothy J. Miller, Vikram Singh | 2013-12-10 |
| 8592783 | Titanium diboride coating for plasma processing apparatus | Kamal Hadidi, Craig R. Chaney | 2013-11-26 |
| 8507372 | Method for processing a substrate having a non-planar substrate surface | Vikram Singh, Heyun Yin | 2013-08-13 |
| 8431495 | Stencil mask profile | Helen L. Maynard | 2013-04-30 |
| 8202792 | Method of processing a substrate having a non-planar surface | Vikram Singh, Heyun Yin | 2012-06-19 |
| 7927986 | Ion implantation with heavy halogenide compounds | Ludovic Godet, Edwin Arevalo | 2011-04-19 |
| 7892985 | Method for porogen removal and mechanical strength enhancement of low-k carbon doped silicon oxide using low thermal budget microwave curing | Seon-Mee Cho, Mike Barnes | 2011-02-22 |
| 7863190 | Method of selective coverage of high aspect ratio structures with a conformal film | Mihai Buretea, Collin Kwok Leung Mui | 2011-01-04 |
| 7863194 | Implantation of multiple species to address copper reliability | Heyun Yin, Vikram Singh | 2011-01-04 |
| 7790633 | Sequential deposition/anneal film densification method | Raihan M. Tarafdar, Ron Rulkens, Dennis M. Hausmann, Jeff Tobin, Adrianne K. Tipton +1 more | 2010-09-07 |
| 7737013 | Implantation of multiple species to address copper reliability | Heyun Yin, Vikram Singh | 2010-06-15 |
| 7687787 | Profile adjustment in plasma ion implanter | Ludovic Godet, Ziwei Fang, Richard Appel, Vincent Deno, Vikram Singh +1 more | 2010-03-30 |
| 7625820 | Method of selective coverage of high aspect ratio structures with a conformal film | Mihai Buretea, Collin Kwok Leung Mui | 2009-12-01 |
| 7589028 | Hydroxyl bond removal and film densification method for oxide films using microwave post treatment | Seon-Mee Cho, Mike Barnes, Michelle T. Schulberg | 2009-09-15 |
| 7586100 | Closed loop control and process optimization in plasma doping processes using a time of flight ion detector | Deven M. Raj, Ludovic Godet, Bernard G. Lindsay, Timothy J. Miller | 2009-09-08 |
| 7491653 | Metal-free catalysts for pulsed deposition layer process for conformal silica laminates | Seon-Mee Cho, Ron Rulkens, Mihai Buretea, Dennis M. Hausmann, Michael Barnes | 2009-02-17 |