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Integration of dry development and etch processes for EUV patterning in a single process chamber |
Younghee Lee, Da Li, Hongtu Zhao, Ji-Yeong Kim, Samantha Tan +4 more |
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Deposition of films using molybdenum precursors |
Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Seshasayee Varadarajan |
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Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition |
Ilanit Fisher, Raashina Humayun, Michal Danek, Shruti Vivek Thombare |
2025-06-17 |
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Molybdenum deposition |
Jeong-Seok Na, Yao-Tsung HSIEH, Chiukin Steven Lai |
2025-06-17 |
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Molybdenum fill |
Lawrence Schloss, Shruti Vivek Thombare, Zhongbo YAN, Joshua Collins |
2025-06-10 |
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Line bending control for memory applications |
Gorun Butail, Shruti Vivek Thombare, Ishtak Karim |
2025-04-08 |
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Ravi Vellanki, Eric H. Lenz, Vinayakaraddy Gulabal, Sanjay Gopinath, Michal Danek +5 more |
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Deposition of tungsten on molybdenum templates |
Shruti Vivek Thombare, Michal Danek |
2024-11-19 |
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Method to create air gaps |
Seshasayee Varadarajan, Bart J. van Schravendijk |
2024-10-08 |
$410,372,000 |
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Molybdenum deposition |
Shruti Vivek Thombare, Michal Danek |
2024-08-27 |
$110,858,000 |
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Tin oxide thin film spacers in semiconductor device manufacturing |
David Charles Smith, Richard Wise, Arpan Mahorowala, Bart J. van Schravendijk |
2024-07-30 |
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Atomic layer deposition of metal films |
Joshua Collins, Griffin John Kennedy, Hanna Bamnolker, Seshasayee Varadarajan |
2024-04-30 |
$255,527,000 |
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Deposition tool and method for depositing metal oxide films on organic materials |
Akhil Singhal |
2024-01-30 |
$261,554,000 |
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Line bending control for memory applications |
Gorun Butail, Shruti Vivek Thombare, Ishtak Karim |
2024-01-02 |
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Systems and methods for homogenous intermixing of precursors in alloy atomic layer deposition |
Ilanit Fisher, Raashina Humayun, Michal Danek, Shruti Vivek Thombare |
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Tin oxide thin film spacers in semiconductor device manufacturing |
David Charles Smith, Richard Wise, Arpan Mahorowala, Bart J. van Schravendijk |
2023-10-10 |
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Metal-containing passivation for high aspect ratio etch |
Karthik S. Colinjivadi, Samantha Tan, Shih-Ked Lee, George Matamis, Yongsik Yu +4 more |
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Method to create air gaps |
Seshasayee Varadarajan, Bart J. van Schravendijk |
2023-04-25 |
$201,276,000 |
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Jonathan D. Mohn, Nicholas Muga Ndiege, David Fang Wei Chen, Wenbo Liang, Shawn M. Hamilton |
2022-03-08 |
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Tin oxide thin film spacers in semiconductor device manufacturing |
David Charles Smith, Richard Wise, Arpan Mahorowala, Bart J. van Schravendijk |
2021-11-23 |
$127,641,000 |
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Method to create air gaps |
Seshasayee Varadarajan, Bart J. van Schravendijk |
2021-08-10 |
$172,238,000 |
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Tin oxide thin film spacers in semiconductor device manufacturing |
David Charles Smith, Richard Wise, Arpan Mahorowala, Bart J. van Schravendijk |
2021-06-08 |
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Akhil Singhal, Martin E. Freeborn, Bart J. van Schravendijk |
2021-03-23 |
$164,801,000 |
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Low resistivity films containing molybdenum |
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Methods for controlling plasma glow discharge in a plasma chamber |
Aaron Bingham |
2020-09-15 |
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