PC

Patrick A. Van Cleemput

Lam Research: 37 patents #55 of 2,128Top 3%
NS Novellus Systems: 15 patents #49 of 780Top 7%
IBM: 1 patents #44,794 of 70,183Top 65%
📍 Duvall, WA: #2 of 384 inventorsTop 1%
🗺 Washington: #957 of 76,902 inventorsTop 2%
Overall (All Time): #46,541 of 4,157,543Top 2%
54
Patents All Time

Issued Patents All Time

Showing 26–50 of 54 patents

Patent #TitleCo-InventorsDate
10510590 Low resistivity films containing molybdenum Shruti Vivek Thombare, Raashina Humayun, Michal Danek, Chiukin Steven Lai, Joshua Collins +3 more 2019-12-17
10388546 Apparatus for UV flowable dielectric Jonathan D. Mohn, Nicholas Muga Ndiege, David Fang Wei Chen, Wenbo Liang, Shawn M. Hamilton 2019-08-20
10373806 Apparatus and method for deposition and etch in gap fill Akhil Singhal, Martin E. Freeborn, Bart J. van Schravendijk 2019-08-06
10262943 Interlevel conductor pre-fill utilizing selective barrier deposition Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more 2019-04-16
10246774 Additive for ALD deposition profile tuning in gap features 2019-04-02
10128116 Integrated direct dielectric and metal deposition William T. Lee, Bart J. van Schravendijk, David Charles Smith, Michal Danek, Ramesh Chandrasekharan 2018-11-13
10049921 Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor Nerissa Draeger, Kaihan Ashtiani, Deenesh Padhi, Derek Wong, Bart J. van Schravendijk +3 more 2018-08-14
9916977 Low k dielectric deposition via UV driven photopolymerization Nicholas Muga Ndiege, Jonathan D. Mohn 2018-03-13
9875968 Interlevel conductor pre-fill utilizing selective barrier deposition Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more 2018-01-23
9824893 Tin oxide thin film spacers in semiconductor device manufacturing David Charles Smith, Richard Wise, Arpan Mahorowala, Bart J. van Schravendijk 2017-11-21
9773643 Apparatus and method for deposition and etch in gap fill Akhil Singhal, Martin E. Freeborn, Bart J. van Schravendijk 2017-09-26
9583386 Interlevel conductor pre-fill utilizing selective barrier deposition Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more 2017-02-28
9245739 Low-K oxide deposition by hydrolysis and condensation Nicholas Muga Ndiege, Krishna Nittala, Derek Wong, George Andrew Antonelli, Nerissa Draeger 2016-01-26
7700155 Method and apparatus for modulation of precursor exposure during a pulsed deposition process Francisco Juarez, Dennis M. Hausmann, Bunsen B. Nie, Teresa Pong, Adrianne K. Tipton 2010-04-20
7208389 Method of porogen removal from porous low-k films using UV radiation Adrianne K. Tipton, Brian Lu, Michelle T. Schulberg, Qingguo Wu, Haiying Fu +1 more 2007-04-24
7176144 Plasma detemplating and silanol capping of porous dielectric films Feng Wang, Michelle T. Schulberg, Jianing Sun, Raashina Humayun 2007-02-13
6951765 Method and apparatus for introduction of solid precursors and reactants into a supercritical fluid reactor Sanjay Gopinath, Michelle T. Schulberg, Sasangan Ramanathan, Francisco Juarez, Patrick Joyce 2005-10-04
6867152 Properties of a silica thin film produced by a rapid vapor deposition (RVD) process Dennis M. Hausmann, Adrianne K. Tipton, Bunsen B. Nie, Francisco Juarez, Teresa Pong 2005-03-15
6846391 Process for depositing F-doped silica glass in high aspect ratio structures George D. Papasouliotis, Robert Tas, Bart J. van Schravendijk 2005-01-25
6766810 Methods and apparatus to control pressure in a supercritical fluid reactor 2004-07-27
6576345 Dielectric films with low dielectric constants Ravi Laxman, Jen Shu, Michelle T. Schulberg, Bunsen B. Nie 2003-06-10
6550484 Apparatus for maintaining wafer back side and edge exclusion during supercritical fluid processing Sanjay Gopinath, Francisco Juarez, Krishnan Shrinivasan 2003-04-22
6395150 Very high aspect ratio gapfill using HDP George D. Papasouliotis, Mark A. Logan, Bart J. van Schravendijk, William J. King 2002-05-28
6340628 Method to deposit SiOCH films with dielectric constant below 3.0 Ravi Laxman, Jen Shu, Michelle T. Schulberg, Bunsen B. Nie 2002-01-22
6258653 Silicon nitride barrier for capacitance maximization of tantalum oxide capacitor Kok Heng Chew, Kathy Konjuh, Tirunelveli S. Ravi 2001-07-10